
The probe placement solution analyzes the printed circuit board design for incircuit or flying probe test access and automatically assigns test probes to board nets. New features for test pin locations give users the ability to accept names and locations generated by the source CAD system. Feedback on additional probe requirements will be given to ensure complete overage. Additionally, any component, pad or via can be marked as a non-probe location or as a forced test pin location, giving the user tremendous flexibility. For flying probe systems, test pin placements can be automatically nudged away from the center of the pad. Properties for every test pin show the nearest adjacent pin, its distance from the current pin and the net associated with it. This information is then used to generate more accurate electrical shorts tests. The probing solution performs a complete geometrical analysis of the board and takes into account board soldermask information and body outline data to quickly produce high quality probing solutions. The speed of the probe placement program gives the user the ability to run many test scenarios in a very short time.
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