Teradyne - Semiconductor Test Division
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Semiconductor Test is a lead-
ing supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. We deliver test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as System-On-a-Chip (SOC) or System-In-Package (SIP) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and internet applications.

Product Integration

Stiffeners

Often overlooked as an expensive piece of metal or plastic, the Interface Board and Probe Card stiffeners are critical to proper peripheral alignment.

By carefully engineering lightweight, high stiffness board stiffeners, Teradyne's design teams are able to improve ergonomics and eliminate continuity problems.

Teradyne stiffeners are designed to carefully balance these specifications. Additionally, stiffener accessories are available that allow our customer improved flexibility by accomodating a range of Device Interface Board thicknesses.

Please contact your local sales representative for availability. Please contact piapps@teradyne.com to explore custom stiffener design requirements.