Archimedes Analytics Solutions
Proven solutions with near-zero test time impact that increase yield, improve quality and reduce tester down time.
Intelligent Needle Cleaning
Inefficient maintenance of probe needles
Existing prober needle cleaning strategies include:
- Needle cleaning at pre-defined intervals (e.g., run once per 500 touchdown), which can result in shortened needle life due to over-cleaning or first-pass yield loss due to contamination build-up on needles when under-cleaning
- Needle Cleaning on-demand based on software bin count/percent. Needle cleaning is triggered based on test result to avoid over-cleaning, resulting in potential negative yield impact due to the trigger happening post failures (after SB results).
Intelligent Needle Cleaning
Needle cleaning is triggered by parametric measurement result variance (e.g., cleaning is initiated when resistance test is above a pre-defined limit).
Up to 30% fewer cleaning cycles without compromising yield.
Preventing Yield and Utilization Loss with Temperature Control
Wafer Handler Temperature Variation Affecting Yield
For devices which are sensitive to high/low temperature testing, yield is impacted due to uneven heating at the handler.
Real-Time monitoring of temperature-related tests by the Process Control Manager
Real-time monitoring of parametric tests that are temperature-related, followed by a relay of the temperature offset to the handler via GPIB Command to get the handler temperature within limit.
Fewer temperature related incidences resulting in higher yield.
Real-Time Dynamic Part Average Testing
Overall equipment effectiveness (OEE) impacted due to dynamic part average testing (DPAT) implementation
Implementation of DPAT requires external post-processing and a second insertion to properly bin devices, resulting in wasted test time.
Real-time DPAT processing
Real-time processing of results and limits allows for in-process binning and eliminates the need for a second test insertion. DPAT can be implemented without impacting OEE.
Improved OEE with a single insertion.
Improved Overall Equipment Effectiveness Through Retest Reduction
Wasted time due to retest
In production test, there are some failures that have very low or zero recovery rate during retest. However, these devices still go through retest because the “retest” BINs cannot be separated without modifying the test programs.
Reduce retest via the Process Control Manager
- Skip retest for specific “SKIP” Bins
- Real-time monitoring for “Non-retest” test-item failures and bin out to specific “SKIP” retest Bin.
- Eliminate the need to modify test programs
Excessive scrap caused by drift or offset in parametric measurement (device trimming).
Trimming is common in PMIC and RF devices. A device that is trimmed when the parametric values are drifting results in inferior quality in mission mode and has a higher probability of failures in the field, resulting in customer returns.
Less scrap, higher yield.
ATE Power Savings
Power usage in idle status is too high.
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Deploy power saving utility.
The power saving utility includes two modes for remote hibernation of the tester from a central test floor management tool.
- Power down entire tester (must be restarted locally)
- Power down instruments only (can be restarted remotely)
Tester power consumption can be reduced by nearly 80% while in the idle state, depending on the configuration.
Tester Fleet Management
Maintaining a fleet of testers can be time consuming and prone to error, resulting in unnecessary tester down time.
Insufficient fleet maintenance can result in:
- Production readiness and efficiency
- Ineffective asset tracking
- Inefficient production history traceability
- Excessive system shutdowns
Tester fleet management
Production Readiness and Efficiency
OSAT production sites often include requirements to reconfigure systems for running a variety of devices. A mismatch of varying resource requirements for test program, and actual ATE installed-base licensing and configurations could result in the inefficient production readiness processes and last-minute surprises. WHAT IS THE TERADYNE SOLUTION?
A centralized and intuitive asset tracking solution that requires less manual intervention, eliminating errors.
Production History Traceability
Track instrument production and movement, and customer return issues.
Basic System Health Monitoring
Intelligent system monitoring to reduce system shut downs when workstation memory and HFE/coolant are not at optimal levels.
Increased operational efficiency and tester uptime.
As the leading provider of complete semiconductor test solutions, we at Teradyne leverage our expertise, experience, and technology leadership to help our customers achieve the highest yield and throughput in production with the fastest time to market. We partner with you in your journey from design to production to provide solutions that solve your challenges.