RS-485, HOTLink, ECL IO Expansion Instrument

Traditional Physical I/O Backed with FPGA Configurability

Best choice when current or future requirements include:

  • RS-485/RS-422 bidirectional signaling, backed with FPGA configurability
  • HOTLink bus support to 1500 Mb/s
  • Discrete ECL signaling backed with FPGA configurability
HSSub 9030
  • Flexible low-level HSSub Tier 1 I/O Bus Processing
    • Reconfigurable HSSub Tier 1 (I/O Bus Processing) of the HSSub Three Tier Architecture implemented by a large Test Defined FPGA and local memory
    • Configured in seconds by HSSub Apps supported by Teradyne, end-users, and third-party developers
    • HSSub App development, if required, is simplified by FPGA template code based on standard design patterns
    • HSSub TriFlex Infrastructure Software interfaces provide access to the hardware from Windows Tier 3 or HSSub Tier 2 instruments
  • Contact Teradyne regarding availability of Flexible IO Expansion Instruments with alternate Physical Interface Module configurations