Magnum VUx for NAND Protocol Test Enhancement

Ultra-High Performance NAND Protocol Test Enhancement to Magnum V Platform

Teradyne’s Magnum VUx system is a flexible, superset test platform for all NAND and MCP products, both cutting edge UFS 3.0, uMCP, and PCIe Gen 4 mobile and automotive devices, as well as SSD NAND ONFI and Toggle, and legacy NAND products such as UFS 2.1, PCIe Gen 3, e.MMC, and eMCP.

Protocol NAND

Advantages

Flexible

Magnum VU is a flexible, superset test platform that uniquely covers all NAND test, not only protocol test of next generation mobile and automotive devices UFS3.0 and PCIe Gen 4, but also the previous generation of mobile devices UFS2.1, PCI Gen 3, even e.MMC, as well as ONFI, Toggle, and raw NAND for the SSD [Solid State Drive]. This flexibility provides the lowest risk investment for all next generation NAND test capacity and engineering.

Scalable

Magnum VU is a long lifetime, scalable test platform. In order to leverage customer’s investments in our test platform, Teradyne designed the Universal Protocol Board to be easily upgradable, originally UPB, this year UPBx, then when the next technology comes UPBy.

Highest Performance and Highest Throughput

Magnum VU is the highest performance, highest throughput test platform. Using Teradyne technology to miniaturize the UPB instrument, Teradyne radically changed the test paradigm, completely eliminating the traditional cabling between the test instrument and device under test [DUT], and directly docking the UPBx to the socket boards. This architecture, called Near DUT Test [NDT], dramatically shortens the signal path, increases performance, reduces latency, and most closely emulates the real system environment.

Applications

  • UFS3.0 & UFS2.1
  • NVMe and custom protocols
  • PCIe Gen3 and Gen4
  • eMMC
  • Toggle NAND
  • Legacy NAND
  • ONFI FLASH
  • MCP
  • eMCP
  • uMCP

Configurations

Magnum VU EV

  • Self-contained, engineering test system for test program development and device debug
  • Configurable up to 16 UPBx to test 64 UFS3.0 or PCIe Gen 4 devices (1-2 lanes)
  • 100% compatible electronics, software, DSAs, cal and diags with Magnum VU SSV and GV production systems

Magnum VU SSV

  • For high volume, production final test applications
  • Configurable up to 128 UPBx to test 512 UFS3.0 or PCIe Gen 4 devices (1-2 lanes)
  • Integrated with Teradyne Vertical Plane Manipulator for efficient docking to industry standard device handlers

Magnum VU GV

  • For highest volume, production final test applications
  • Configurable up to 192 UPBx to test 768 UFS3.0 or PCIe Gen 4 devices (1-2 lanes)
  • Integrated with Teradyne Vertical Plane Manipulator for efficient docking to industry standard device handlers