DIB complexity doubles every four years with total hardware cost increasing rapidly, and a solution to quickly and efficiently verify DIB quality is imperative. The goal of DIB DIAG products is to identify DIB-related failures at both the NPI phase and the production phase, and help DIB DIAG application engineers quickly develop DIB DIAG test programs to perform quick troubleshooting in different phases. Early detection of DIB-related issues will improve time-to-market and decrease costs. This presentation will discuss Teradyne’s DIB DIAG products for different tester platforms, including UltraFLEX, UltraFLEXplus, J750, ETS364, and the ETS800. We will detail their general structure; current state; how they have evolved, becoming more intelligent, with increased test coverage and less manual work; and the application process and strategy.