Realizing the next level of device quality and understanding in test engineering requires new solutions beyond the standard statistical data techniques. This involves looking beyond single test statistics to system-level coverage techniques, while ensuring minimum production risk. By combining on-chip agents with advanced analytics and machine learning in the cloud and at the edge, end-product performance, reliability and quality improvements can be achieved. The benefits of this approach go beyond semiconductor testing, extending to system level test and in-field monitoring. This presentation discusses the underlying technology provided by proteanTecs and how it can be combined with UltraFLEX and UltraFLEXplus workflows to improve the ability to ramp devices quickly without additional product development risk to deliver a higher quality product.