Device cooling is receiving renewed interest as large digital devices become more commonplace in applications such as Artificial Intelligence (AI), Machine Learning (ML), and non-battery based applications. We’ve seen processor technology evolve over the years from air cooling to liquid-based cooling to device-responsive cooling, however some of the objectives of cooling remain elusive due to the proximity of thermal sensing, cooling techniques, and device packaging. This presentation will discuss the objectives of device cooling, specifically, avoiding front-end hardware damage and yield improvement, as well as some of the obstacles to maintaining a constant temperature at the transistor junction (thermal mass, time constants, effect of different cooling media). Additionally, the Automatic Thermal Control (ATC) cable option for the UltraFLEXplus will be reviewed to demonstrate its capabilities, and how to use this interface to communicate with external thermal equipment.