Today’s Integrated Circuit (IC) devices have smaller geometries and lower voltages. As such, maximum voltage ratings are getting smaller and more sensitive to electrical over stress (EOS). This is further complicated by smaller differences between the working voltage of an IC device under test (DUT) and the maximum voltage the DUT can tolerate. Traditional Tester VI Kelvin run away protection may not be sufficient to protect the IC or DUT for production test. It is not unusual when a Sense path connection is lost, due to a poor contact, that the forcing voltage or forcing current will exceed the DUT maximum voltage rating and electrically over stress the DUT. This presentation will discuss a variety of different Kelvin run away and clamping methods to protect the DUT in cases with poor contact during production testing. These techniques are test platform agnostic but will be shown relative to the ETS-800 instruments.