During wafer probe testing there was a situation in which a probe card burned twice in two weeks. We determined that the root cause was the high current functional tests. To resolve the issue we collected current profiles for all functional items so that the designer could analyze and provide updated device settings for some of the high current test items. In addition, we also adjusted the programmed settings of the UVS64 to reduce the duration of any over current events. This presentation we will review the DCVS programming features which can be used to reduce the likelihood of a burned probe card, including VSlewRate in Pin Levels sheet, DCVS Behavior, Fold, and Timeout Settings and power off sequencing.