Using GreenPAK for Low-cost, Flexible and Fast Failure Prevention Circuit | Teradyne

In recent years, the market size of power discrete devices has been expanding due to the growing demand for EVs. Unclamped Inductive Switching (UIS) testing is a required test for Power MOSFETs, which are typical power discrete devices. UIS testing is required at the wafer, KGD (Known Good Die), and package stages. The UIS test turns on the DUT, stores current in the L load connected in series with the power supply on the drain side, and then turns off the DUT to make the DUT operate in avalanche by the back EMF of the L load and the power supply voltage, and measure the energy during the avalanche period. Since DUTs with low avalanche immunity are destroyed during UIS testing, the measurement circuit requires a protection circuit to prevent circuit component destruction in the event of DUT destruction. This presentation will introduce a low-cost, flexible, and fast failure prevention circuit using GreenPAK.

In this method, we can reduce the number of components, time to debug circuit and module size because of using GreenPAK which allow user to easily develop logic circuit on one chip by arranging symbols and parameters on software “Go Configure” provided by Renesas.