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SCALING THE HEIGHTS OF TEST 

Thank you to all of the attendees and vendors who took part in the the 2016 Teradyne Users Group (TUG) Conference in Denver.

SAVE THE DATE: TUG 2017 | May 1-3, 2017 | San Francisco, California

CONGRATULATIONS TO THE BEST PAPER WINNERS!

Design and Performance Validation of 28G Capable ATE Test Sockets for UltraFLEX (12)
Noel Del Rio, NXP 

Tester SPC (76)
Carolina Lock and Nelson Magdaleno, Texas Instruments

DDR I/O Spec Characterization at 2133 Mbs (105)
Ken Scheuer and Will Forfang, NXP: John Gatej, Teradyne

Understanding Sample Rate Conversion Using No Math (68)
Scott Therrien, Teradyne

ETS-800: 80A FI/FV Energy Test Solution with SPU-2112 (112)
Ingo Wahl, Teradyne

Leveraging the Cloud - Using Cloud Computing for Pattern Compilation (74)
Ross Youngblood, Teradyne