New environmental regulations to reduce average CO2 emissions and automotive trends have accelerated the deployment of electric vehicles and hybrid electric vehicles. As one of the key components of power converters and inverters, power modules demand is growing rapidly. Due to high vehicle safety standards and harsh environments, automotive power modules often have stricter requirements on power efficiency, robustness, reliability, weight, volume, and cost than industrial products.

One power module normally packs multiple power discrete chips to get higher power density with smaller size. The quality of each chip directly affects the reliability of the module. To increase the reliability and lower the module packing cost, more test requirements are added to power discrete wafer prober test and some manufacturers have started to do KGD (Known Good Die) test for more test coverage.

This paper will introduce power discrete KGD test concepts, talk about the difference between wafer prober test and KGD test, power discrete KGD test challenges and Teradyne solutions to address different test requirements.