Failure analysis is necessary in order to understand what caused the failure and how it can be prevented in the future. Electrical Failure analysis is the process of determining how or why a semiconductor device has failed, often performed as a series of steps known as EFA techniques. In this presentation, the author will introduce the ATE involved EFA techniques including LVx(Laser Voltage Probing and Imaging) and DLS/LADA(Dynamic Laser Stimulation / Laser Activated Device Alteration). After that, the author will explain the requirements for ATE to carry out those techniques, and challenges if the scan patterns being used are SSN(Streaming Scan Network) patterns. He will then demonstrate a proposal from Siemens for workflow changes to address those challenges, and a Teradyne’s tool solution for processing SSN patterns that will be used in those processes.