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Test System for High-Speed, High-Quality Image Sensor Test

Teradyne's IP750 series dominates the image sensor tester market with its superior performance and low cost of test. The IP750 delivers high throughput and high parallel test efficiency, broad device test coverage from CCD and CIS, analog and digital capture, and concurrent image sensor and logic testing. In addition, Teradyne's  IG-XL software environment provides easy, shorter test program development and easy maintenance.

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  • Applications

    Still and Movie Cameras

    • Smartphones and Media Tablets
    • DSC cameras
    • Security cameras
    • Scanning imagery
    • Space satellite cameras

    Image Detecting Devices

    • Automotive safety
    • Sensors for body scanners
    • X-rays
    • Infrared thermograph
    • Scanning imagery
  • Advantages

    High Throughput

    • Powerful CPU for image data processing for high pixel resolution device
    • High speed data transfer at 40Gbps per instrument parallel
    • Up to 96 sites in parallel test with 16 slot test head
    • The highest parallelism with high parallel test efficiency available today ensures the lowest COT

    Broad Device Coverage - up to 128M Pixels

    • High versatility for testing a broad range of devices – VGA to 32M pixels with ICUA analog capture and MIPI LVDS capture capability using ICMD
    • Only instrument solution in the market with custom LVDS protocol coverage
    • Strong SoC test capability with digital instrument for SoC type image sensor

    Single Platform

    • Built on Teradyne’s J750 test platform
    • IP750 series can be upgraded on-site to IP750Ex-HD or J750Ex-HD to better utilize valuable assets in a rapidly changing market environment

    Test Program Compatibility

    • IP750EP/EMP test programs can run on IP750Ex/Ex-HD with minor conversion

    IG-XL Software

    • Built using Microsoft Excel which provides a user-friendly interface for fast program development
    • Enables easy upgrade of test programs from single to multisite, dramatically reducing the workload of test engineers on mass production launches
    • Common software environment for the IP750, J750, and FLEX family, eliminating the need to train test engineers for software programming on separate testers
  • Configurations

    IP750Ex

    • 32 site system capable for wafer test
    • ICMD 1.5Gbps MIPI D-Phy  image capture instrument
    • Custom LVDS capture capability with ICMD
    • ICUA2 up to 100MHz analog image capture instrument
    • ICUD200 200MHz 32M pixel / Channel 24 bit depth/pixel
    • HSD200 200MHz Digital instrument
    • HDDPS 24/48Ch DC source
    • 20Gbps image data transfer  
    • 110mm diameter illuminator support

    IP750Ex-HD

    • 96 site system capable for wafer test
    • ICMD 1.5Gbps MIPI D-Phy  image capture instrument
    • Custom LVDS capture capability with ICMD
    • HSD800 400MHz Digital instrument
    • HDDPS 24/48Ch DC source
    • 40Gbps image data transfer
    • 150mm x 160mm illuminator support
    • Compatible with J750Ex-HD instruments
  • System Options

    VI Resource

    • APMU
    • HDAPMU
    • HDVIS

    Converter Test

    • CTO
    • HDCTO 

  • Software

    IG-XL-245x100-TeradyneTeradyne’s award-winning IG-XL Software transforms test program development. Its powerful, yet easy-to-use, graphical environment lets engineers rapidly develop fully functional test programs, cutting program development and debugging time. Designed to address multisite complexity, IG-XL can convert single site test programs to multisite automatically, speeding time to market and reducing cost of test. With IG-XL, test engineers focus on actual testing, not writing code for the tester.

    Learn more about IG-XL Software