UltraFLEXplus SoC Tester
The World’s Leading SoC Device Test Platform
The UltraFLEXplus combines new instrument and software capability with a revolutionary tester infrastructure that provides a step-function improvement in throughput and engineering efficiency – all while leveraging the cumulative test IP developed over the UltraFLEX’s 15 year history .
The UltraFLEX Family
AI and 5G are the latest in a long line of enabling technologies that have improved communication and productivity. With every breakthrough technology, the UltraFLEX family of testers has been there making sure quality is an integral part of the IC production process. As technology has progressed, Teradyne has added instrument and software capability to the UltraFLEX, all while preserving our customers’ investment in equipment, IP, and training with unmatched compatibility and product lifetime support.
We continue to enhance our customers’ investment in UltraFLEX with a suite of new instrumentation and new versions of the industry-leading IG-XL software. This continuous delivery of capability and compatibility continues with the UltraFLEXplus, which combines new instrument and software capability with a revolutionary tester infrastructure that provides a step-function improvement in throughput and engineering efficiency – all while leveraging the cumulative test IP developed over the UltraFLEX’s 15 year history .
Most importantly the UltraFLEX family of testers is able to reduce the engineering effort required to bring develop and deploy new test programs by using the #1-rated IG-XL software, an industry standard which has been continuously enhanced since its introduction over 15 years. Continuous improvement in quality, along with supporting new generations of instrumentation, all while maintaining code compatibility and leveraging the skills of over 10,000 active programmers has set Teradyne and UltraFLEX apart from other ATE offerings.
Teradyne’s UltraFLEXplus addresses the test needs of processors and ASICs integral to deploying AI and 5G networks. The UltraFLEXplus does this while maintaining seamless compatibility with the nearly 5,000 UltraFLEX systems installed worldwide and leveraging the IG-XL™ code libraries currently deployed at over 92% of the world’s IC manufacturers.
What device trends are driving new test requirements?
First, as the complexity of devices with more features are enabled with smaller silicon process geometries, more test steps are required to trim, repair, and test each device.. And, as transistor count increase, fault coverage required to meet minimum quality standards becomes a greater challenge
All this additional test must be accomplished with reasonable overall production costs. This challenge has always faced device manufacturers and is not new, but how it is achieved has changed. Design for Test (DFT) such as scan compression has historically lowered test times, but DFT cannot keep up with increased device complexity. In order to manage test costs, test cells must become more productive, even in the face of increasing test times
All of this new device complexity must be addressed in an environment where there is continuing pressure to bring new products to market as quickly as possible. The industry is experiencing a significant increase in the engineering effort due required the exponential challenge of shorter IC development cycles and the need for greater test intensity.
Solutions That Meet Emerging Test Requirements
The UltraFLEXplus increases manufacturing productivity by reducing the number of test cells required to for IC production by 15%-50% UltraFLEXplus accomplishes this by delivering higher site counts and improved parallel test efficiency by reducing multisite test time overhead. Reducing the number of test cells provides the greatest reduction in overall manufacturing costs since fewer test cells translates into fewer prober and handlers, less facility power, and fewer operators.
Teradyne has also improved accuracy and consistency of critical measurements with third generation instrumentation and a new Device Interface Board (DIB) architecture. And, customers can leverage their capital investment by doubling the life of the tester with a highly scalable architecture and an upgradeable signal delivery and computing infrastructure.
Higher Manufacturing Productivity
UltraFLEXplus introduces the innovative PACE™ runtime architecture to deliver the highest test cell throughput with minimal engineering effort. PACE achieves this with higher data bandwidth to instrument hardware and a Distributed Multi Controller (DMC) computing architecture. The Multi-Core System Controller keeps the instruments working efficiently and in unison for higher throughput. By increasing productivity with higher site counts and improved parallel test efficiency, manufacturers are able to deploy 15%-50% fewer test cells.
Broadside™ Applications Interface
The “Broadside” Applications Interface on the UltraFLEXplus delivers faster time to market by simplifying DIB routing and providing significantly improved site-site correlation. The Broadside DIB structure rotates the instrument boards 90 degrees compared to traditional ATE so instrument resources are delivered parallel to the device applications area. That means a better matched signal path per site. By simplifying what is typically a complex DIB layout, there is faster time to market, higher site counts and higher PC Board yield.
The combination of IG-XL software, the unique PACE Architecture and Broadside Applications Interface enables test engineers to release new test programs into production with less effort and higher quality.
Suite of New High Performance Third Generation Instruments
UltraPin2200 – next generation digital instrument
- High density, 512 channels per instrument
- 32 pattern generators per instrument for concurrent test or unique pattern flows per site
- Proprietary, hardware-based Protocol Aware capability
- Dedicated memories for non-deterministic data testing
- Up to 16Gbit scan test capacity with a flexible pattern memory architecture
- Data sharing across sites
UVS256-HP – High density, highly flexible general-purpose device power supply
- 256 channels per instrument
- Flexible merge capability
- Excellent dynamic performance
- Low noise
- Four quadrant voltage or current source and measure
UVS64 – next generation core power supply instrument
- Extremely accurate, stable resource for device core supplies
- Unmatched dynamic performance
- <1mV 6 Sigma voltage accuracy
- Up to 320 Amps of device power per instrument
- Merge up to 1,600A for a single supply
- Supports instantaneous system-wide current steps of up to 2,560Amps
UltraPAC300 – next generation high density analog instrument
- High performance audio and baseband AC instrument
- Coverage up to 300MHz
- Dual mode high speed and high-resolution channels