Test System Optimized for High-Performance Digital and SoC
Delivering superior economics and fast time to market with the industry’s highest rated software, the UltraFLEX test system has the power and precision you need for complex SoC devices. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count.
Superior Flexibility, Throughput & Scalability
The UltraFLEX scales from low pin count, analog-dominant devices to massive parallel test of high-end processors with superior parallel.
Maximum Test Quality and Yield
The UltraFLEX’s performance allows integrated circuit producers to meet the conflicting goals of “zero” defect rates and maximum device.
- Mobile Application Processor
- Digital Baseband Processors
- High Data rate RF Transceivers
- RF Connectivity Devices
- Mobile Power Management ICs (PMIC)
- Network Processors
- High Speed SERDES (SERializer/DESerializer) and backplane transceivers
- Storage Controllers
- High End Microcontrollers
- Audio and Video Processors
The three available UltraFLEX base systems allow customers to optimize capital cost, floor space and maximum resource count. All three versions will accept the same DIBs (Device Interface Boards) for application portability and use exactly the same instrument options for the most effective capital reuse and production flexibility. All heads feature a universal slot architecture, which allows any instrument to be installed in any slot.
The UltraFLEX test heads utilize SureMate® connections to the DIB which provides easy system reconfiguration and optimum instrument performance at the applications interface. Liquid cooling of high-density instrumentation also guarantees consistent hardware performance and increased reliability.
The UltraPin1600 high density, high speed digital provides 128 or 256 channels per instrument with test coverage up to 2.2Gbps. The UltraPin1600 implements Teradyne’s ground-breaking multicore, hardware-based Protocol Aware capability that allows individual pin groups to be saved to device data rate and timing and eliminates the need for digital patterns for programming standard data busses.
Proprietary hardware for same-cycle source synchronous capability and “walking strobe” timing measurements provides production test capability for high speed DDR and other critical applications when needed. The UltraPin1600 is also test program compatible with the earlier UltraPin800 and HSD1000 digital options.
The UltraWave12G/UltraWave24 high port count RF options provide up to 96 universal, vector RF ports with carrier frequencies and modulation bandwidths to cover the most advanced cellular and connectivity standards. The UltraWave options offer accuracy and phase noise performance equal to or better than the highest performance bench equipment available and integrate waveform sourcing and capturing onboard to eliminate the need for extra tester instruments. The UltraFLEX ESA software toolkit and UltraDSP1 option provide industry-standard modulation and demodulation tools running on up to 32 dedicated processing cores with automatic data download via a dedicated high speed data bus for simple correlation to industry standards and the highest possible throughput.
The UltraWaveMX44 and UltraWaveMX20 instruments enables faster time to market and higher product yields for semiconductor devices used in emerging mmWave applications. The MX44 and MX20 extend the UltraWave24 capability for full test coverage of IoT, WiFi, LTE, Ultra Wideband, and 5G standards while maintaining full DIB and docking compatibility.
As the leading provider of complete Test Cell Solutions and services, we at Teradyne leverage our expertise, experience, and technology leadership to help our customers achieve the highest yield and the highest throughput in production with the fastest time to market. We partner with you in your journey from design to production to provide standard and customized test cell products and services.