Test System Optimized for High-Performance Digital and SoC
Delivering superior economics and fast time to market with the industry’s highest rated software, the UltraFLEX test system has the power and precision you need for complex SoC devices. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count.
Superior Flexibility, Throughput & Scalability
The UltraFLEX scales from low pin count, analog-dominant devices to massive parallel test of high-end processors with superior parallel.
Maximum Test Quality and Yield
The UltraFLEX’s performance allows integrated circuit producers to meet the conflicting goals of “zero” defect rates and maximum device.
- Mobile Application Processor
- Digital Baseband Processors
- High Data Rate RF Transceivers
- RF Connectivity Devices
- Mobile Power Management ICs (PMIC)
- Network Processors
- High Speed SERDES (SERializer/DESerializer) and Backplane Transceivers
- Storage Controllers
- High-end Microcontrollers
- Audio and Video Processors
The two available UltraFLEX base systems allow customers to optimize capital cost and floor space, and maximize resource count. All three versions will accept the same device interface boards (DIBs) for application portability and use exactly the same instrument options for the most effective capital reuse and production flexibility. All heads feature a universal slot architecture, which allows any instrument to be installed in any slot.
The UltraFLEX test heads utilize SureMate® connections to the DIB which provide easy system reconfiguration and optimum instrument performance at the applications interface. Liquid cooling of high-density instrumentation also guarantees consistent hardware performance and increased reliability.
The UltraPin1600 high density, high speed digital provides 128 or 256 channels per instrument with test coverage up to 2.2Gbps. The UltraPin1600 implements Teradyne’s ground-breaking multicore, hardware-based Protocol Aware capability that allows individual pin groups to be saved to device data rate and timing and eliminates the need for digital patterns for programming standard data busses.
Proprietary hardware for same-cycle source synchronous capability and “walking strobe” timing measurements provides production test capability for high speed DDR and other critical applications when needed. The UltraPin1600 is also test program compatible with the earlier UltraPin800 and HSD1000 digital options.
The UltraPAC80 high density AC source and capture instrument offers up to 8 source and capture channels, each with dedicated audio and video analog paths. Teradyne’s proprietary sample clock architecture provides the user with complete sample frequency flexibility without performance compromise and guaranteed phase alignment to every other instrument on every run of the test program to eliminate the need for job-specific calibration to achieve the phase balance required for the highest performance RF transceivers.
The UltraVI80 high pin count, high accuracy voltage and current option provides 80 independent pins of “3-in-1” capability. Each UVI80 pin is a true voltage or current (VI) source and measure instrument complete with ultra high-accuracy differential voltmeters and time measurement units available to each pin for complete, massively paralleled testing of mobile power management devices. In addition, UVI80 channels can operate in a special, low-droop voltage source mode that offers unmatched power supply noise performance for sensitive analog and RF applications. Finally, each UVI80 channel has an embedded high performance AC waveform source and measure capability for highly paralleled test of D/A and A/D converters embedded in complex SOC or microcontroller devices.
The UltraVS256 high density Device Power Supply (DPS) provides 256 independent channels per instrument to provide the massively paralleled capability required by low power mobile communications devices. The UVS256 also offers a clamp-based current source capability for device parametric testing. The UVS256 provides test engineers with the capability of programmable output bandwidth and full pattern setup and measure control that results in reduced DIB complexity and faster test times.
The HEXVS and VSM Ultra High Accuracy and Stability Processor Core Supplies improve performance and yield of complex processors by offering unmatched voltage accuracy and stability under load. This allows devices to be configured for maximum performance at lower voltages, increasing the value and yield of devices tested on UltraFLEX.
The DC30 and DC75 voltage/current supplies extend DC capability to 30 volts and 75 volts to address high voltage test requirements of of mobile power management and other devices. Like the UltraVI80, both options contain a precision differential voltmeter and time measurement capability.
The UltraSerial10G is a high-speed serial instrument that can test expanding serial bus technologies and replicates the device operating environment for optimal test quality at device limited test time with the highest possible throughput. This instrument has 20 differential drive and receive ports (40 channels/80 wires) per board, a frequency range of 42Mbps to 10.7Gbps with 426M drive/compare, and 1Gig capture memory, and includes pseudo-random bit stream (PRBS) hardware, and protocol aware testing support for PCIe. All of these features are designed to provide an efficient test methodology for SerDes bus testing.
The UltraWaveLX subsystem, available in multiple configurations, delivers emerging wireless protocol capabilities by seamlessly integrating LitePoint’s leading edge technologies within the UltraFLEX platform.
The UltraWaveLX-RF delivers 802.11be (Wi-Fi 7) testing capabilities, while the UltraWaveLX-UWB serves UWB testing conditions, and the UltraWaveLX-60G supports mmWave applications in the 60 GHz band. These configurations can be combined to deliver multiple cutting-edge RF test capabilities within a single test platform.
The UltraWave24 high port count RF options provide up to 96 universal, vector RF ports with carrier frequencies and modulation bandwidths to cover the most advanced cellular and connectivity standards. The UltraWave options offer accuracy and phase noise performance equal to or better than the highest performance bench equipment available, and integrate waveform sourcing and capturing onboard to eliminate the need for additional tester instruments. The UltraFLEX ESA software toolkit and UltraDSP1 option provide industry-standard modulation and demodulation tools running on up to 32 dedicated processing cores with automatic data download via a dedicated high-speed data bus for simple correlation to industry standards and the highest possible throughput.
Teradyne is the leader in RF/wireless device testing and has a large installed base of UltraFLEX test systems with the UltraWave24 RF instrument. As new devices for handset and base station applications are introduced using mmWave technology, Teradyne’s mmWave instrumentation has expanded in anticipation of testing demands.
The UltraWaveMX53, UltraWaveMX44, UltraWaveMX20-D16 and UltraWaveMX8 are Teradyne’s MX family of instruments for mmWave frequencies. These instruments extend the UltraWave24 capability for full test coverage of WiFi, LTE, Ultra-wideband and 5G standards for frequencies below 52.6 GHz. Existing UltraWave24 customers can upgrade their systems with a single slot instrument that does not require reconfiguration of the test system. They can continue to use existing device interface boards (DIBs) and production interface docking compatibility for their existing applications.
The MX family of instruments targets RF and IF interfaces for both 5G IF transceiver and 5G RF beamformer device coverage. And they support characterization and production device testing for probe, package, module and over-the-air applications.
A patented active thermal control within the instrument guarantees temperature stability to ensure that high-performance specifications are met in the engineering and production environments. The UltraWaveMX instruments also feature integrated power detectors which provide specification traceability. There is a dedicated low phase noise DUT reference clock operating from 100 MHz to 6 GHz to supply a precision reference clock for devices with integrated PLLs.
These instruments feature native 5G-NR modulation and demodulation test coverage with the integrated ESA toolkit using industry-standard waveform algorithms for waveform modulation and demodulation to simplify bench-to-ATE correlation.
The instruments provide dedicated mmWave frequency blind-mate coaxial DIB connections, which are designed to withstand the challenges of a production environment while providing the performance to source and measure high quality from 8 GHz to 53 GHz test waveforms to the device.
The award-winning IG-XL test software environment enables simple programming for fast test program development. Interactive debug displays integrated with the instrument hardware create an intuitive software system that minimizes training and speeds time to market.
The UltraWaveMX53 addresses the need to cover the 5G FR2 frequencies up to 52.6 GHz. The instrument provides unmatched performance over the full frequency range with fully integrated temperature stabilization and calibration features. The integrated synthesizer per channel architecture provides best-in-class phase noise performance that enables source and measure capabilities of modulated waveforms with unprecedent EVM performance.
The UltraWaveMX53 instrument is available in three configurations: -D16, -IF and -RF. Each of these configurations provide two channels and 16 ports that cover up to 53 GHz. The IF and RF configurations add two more channels with a total of 16 additional ports that cover up to 20 GHz and 44 GHz respectively.
Teradyne’s UltraWaveMX44 provides coverage from 24 GHz to 44 GHz. The available 32 mmWave ports on the UltraWaveMX44 significantly simplify DIB design. For greater site density, the system can scale to up to 128 mmWave ports, which is necessary for multisite testing that delivers the lowest cost of test.
The UltraWaveMX20-D16 is Teradyne’s lower frequency band instrument. It is also an extension to the UltraWave24 to provide additional test coverage up to 20 GHz. This frequency band targets devices that have WiFi-6, Cellular 5G, Ultra-wideband, and 5G-NR IF interfaces. Each UltraWaveMX20-D16 provides 16 mmWave ports in the test system with the ability to scale to 64 mmWave ports for high site count testing.
The UltraWaveMX8 adds mid-band RF test capabilities to support WiFi-6E & 5G test needs. Adding the MX8 as a 1-slot upgrade to any UltraFLEX system with UltraWave24 extends the frequency range to 7.5GHz. Up to 160 MHz of bandwidth is available for supporting 802.11 modulated tests, and 16 RF ports with 8 channels are provided for high parallelism and efficiency. The MX8 provides industry-leading WiFi-6E test capabilities with faster time to market, higher yields, and lower costs.
By utilizing Teradyne’s UltraWave instruments, semiconductor manufacturers can configure their test systems with the most cost-effective solution to test current and future generations of mmWave devices, enables faster time to market and higher product yields. The MX44, MX20, and MX8 extend the UltraWave24 capability for full test coverage of IoT, WiFi, LTE, Ultra Wideband, and 5G standards while maintaining full DIB and docking compatibility.
As the leading provider of complete Test Cell Solutions and services, we at Teradyne leverage our expertise, experience, and technology leadership to help our customers achieve the highest yield and the highest throughput in production with the fastest time to market. We partner with you in your journey from design to production to provide standard and customized test cell products and services.