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Low-Cost, High-Efficiency Parallel Memory Test Solution

The market leader in flash device test, Teradyne's Magnum test system delivers high throughput and high parallel test efficiency for non-volatile memories, static RAM memories and logic devices. Magnum's largest configuration provides up to 5120 digital channels and all Magnum configurations provide a 50MHz pattern rate and 100Mbps DDR rate on each channel.

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  • Applications

    Memory

    • NOR FLash
    • NAND Flash
    • SRAM
    • DRAM
    • MEMs

    Embedded Memory

    Mixed Logic

     



  • Advantages

    Single, Scalable Platform 

    • Scales from low-channel count engineering solutions to high-channel count production solutions with superior throughput and high parallel test efficiency
    • One platform tests a variety of memory and logic devices, including Memory, Embedded Memory and Logic Test

    Multisite Architecture

    • Highly parallel tester architecture automates the task of testing hundreds (up to 640) of devices in parallel.

    Highly Parallel NOR/NAND Flash Device Test

    • Tests up to 80 NOR Flash devices with up to 64 device pins and up to 320 NAND Flash devices up to 16 device pins
    • Tests up to 320 NOR Flash devices with up to 16 device pins or 640 Flash devices with up to 8 DUT pins

    All I/O channels

    • Maximizes utilization of tester resources and maximizes parallelism
    • Provides maximum flexibility in mapping memory and logic devices into the available pin resources because they are not dedicated in function

    ECR Memory per DUT

    • Each DUT's failure information is captured into unique memory space and is not shared with other DUTs
    • Each of 64 I/O pins failure are address mapped into unique memory space for highly parallel error capture performance


  • Configurations

    Magnum EV

    • Self- contained, low-power engineering test system
    • Ideal for customer office applications that require test program development and debug
    • Up to 256 digital I/O pins
    • Fully compatible with Magnum production systems
    • Runs on standard 110 VAC power (220 VAC Europe)

    Magnum PV

    • Final test and wafer sort applications from engineering to production
    • From 128 pins to 640 pins
    • Easily integrated into third party manipulators
    • Single chassis manipulator mount

    Magnum SV

    • High-mix production solution
    • Up to 1280 digital pins for parallel test
    • Final test and wafer sort production
    • Compatible with industry standard handlers and wafer prober, including hinge and column  manipulators

    Magnum SSV FT

    • For final test applications
    • Integrated with Teradyne Vertical Plane Manipulator for direct docking to very high capacity device handlers
    • Single or dual cavity handler configurations
    • System-mounted docking hardware

    Magnum SSV WS

    • For Wafer Sort applications
    • Easily integrated to a number of third party hinge and column manipulators
    • Manipulator motor lock-out solution that communicates with the prober that the interface is latched

    Magnum GV FT

    • For final test applications 
    • Integrated with Teradyne Vertical Plane Manipulator for direct docking to very high capacity device handlers
    • Single cavity or dual cavity handler configurations
    • System-mounted docking hardware

    Magnum GV WS

    • For wafer sort applications
    • Easily integrated with third  party hinge and column manipulators
    • Manipulator motor lock-out solution that communicates with the prober that the interface is latched


  • System Options

    MPAC

    • Analog source and capture option
    • Available with 24- or 48-channels of source/capture/Vref
    • Voltage reference for multiple test applications including embedded converters
    • Integrated parametric measurement unit (PMU) available at any instrument channel

    DPS

    • Option for testing low pin count devices that must be tested highly parallel
    • Available in 32- and 64-channel configurations

    VRC

    • Voltage Reference Channel option
    • Available in 32- and 64-channel configurations
    • Programmable through the application programmers interface (API)

    MPAC24/DPS32

    • Option is a combination of 24 MPAC channels and 32 DPS channels

    VRC32/DPS32

    • Option is a combination of 32 VRC channels and 32 DPS channels.

    Interface Solutions

    DIB's, PIB's, Loadboards, Calibration BD's, DUT BD Stiffener Kits, Probe Card Stiffener Kits. Final Test Interfaces, Wafer Probe Interfaces, Docking Solutions, and Test Cell Integration



  • Software
    Magnum’s software has been architected to provide test engineers with true device-oriented parallel test programming environment. A test engineer writes a test program for a single device and the systems hardware clones the tests into multiple sites automatically. Test programs developed on the Magnum EV or PV can be used on production version Magnum’s to maximize parallel test. All the software tools are site savvy, enabling test engineers to investigate device performance, on any DUT site, as though it was a one-site tester.