Powering Innovations in Artificial Intelligence with Advanced Test Solutions
Teradyne is the trusted partner that matches ever increasing requirements of next generation AI devices with advanced ATE capabilities needed to bring up devices quickly, optimize yield and improve silicon performance.
We Understand AI Device Manufacturing From Design to Production
AI devices trends push test requirements for high-current, high-performance power supply capability and flexible digital instruments. AI semiconductor designs bring new requirements for enhanced test coverage to ensure quality and drive yield of the complex AI device in production.
AI device test customers count on Teradyne – because knowing what customers need and when, in their critical workflow, matters.
Our AI Customers Count on Us
Teradyne is helping leading innovators deploy the advanced test capabilities needed to introduce new AI devices quickly, to optimize yield and to improve silicon performance.
Teradyne Delivers With Instrumentation on the UltraFLEX Family of Testers
Ensures quality test, throughput and fast time to market needed for 64 Bit Central Processing Units (CPU), Terabyte disc drive components, Application Processors (AP), mobile power management, secure elements and other complex SoC devices.
Suite of New High Performance Third Generation Instruments
UltraPin2200 – next generation digital instrument
- High density, 512 channels per instrument
- 32 pattern generators per instrument for concurrent test or unique pattern flows per site
- Proprietary, hardware-based Protocol Aware capability
- Dedicated memories for non-deterministic data testing
- Up to 16Gbit scan test capacity with a flexible pattern memory architecture
- Data sharing across sites
UVS256-HP – high density, highly flexible general-purpose device power supply
- 256 channels per instrument
- Flexible merge capability
- Excellent dynamic performance
- Low noise
- Four quadrant voltage or current source and measure
June 9, 2020
10:00 am EDT
LinkedIn Live: Serial Scan
Join Strategic Product Marketing leader for Cloud & AI, Sam Rosen, as he answers questions about serial scan and addresses Teradyne’s approach during this short webinar.
June 25, 2020
10:00 am ET
LinkedIn Live: Challenges of High Power Processor and ASIC Testing
Join Principal Technologist Ken Lanier as he answers questions and discusses the challenges associated with testing the newest Processors and ASIC devices that can have Power Supply requirements of many hundreds of amps in a high volume manufacturing environment.