The AI buildout is blurring the line between semiconductor test and factory automation and Semiconductor Review just recognized Teradyne as the Top Semiconductor Test & Robotic Solution 2026. President and CEO Greg Smith frames the strategy simply: the AI revolution demands test and physical AI solutions that span the full journey from wafer to data center. This feature traces that path, from wafer sort and system-level test to the collaborative and autonomous robots keeping material moving on the floor, and shows how tightly integrating the two helps manufacturers deliver on throughput and quality.
“As the industry races to maximize production of AI-accelerated servers at the highest quality levels, our robots bring the flexibility and precision to maximize build quality, while our test solutions detect defects as early as possible,” says Smith.
Read his full perspective in Semiconductor Review.
Greg Smith is the President and CEO of Teradyne. In February 2023, he became Teradyne’s CEO and joined the board of directors. From 2020-2023, Greg was the President of Teradyne’s Industrial Automation Group (now Robotics), growing the revenue 44%. Greg joined Teradyne’s Semiconductor Test Division in 2006 as the Marketing Manager for digital test and held a number of roles, ultimately leading the group as Division President from 2017 to 2020, when revenue grew over 50%. Prior to Teradyne, Greg held engineering, marketing and leadership positions in groups developing test equipment at Raytheon and LTX. He holds a bachelor’s degree in Electrical Engineering from the University of Pennsylvania.