Silicon drives the entire AI transformation of the global economy. Teradyne makes sure that silicon is ready.
Every token generated, every model trained, every AI inference at the edge, it all starts with silicon that works. As hyperscalers invest hundreds of billions into AI data centers over the coming years, the complexity of that silicon is exploding: AI accelerators, HBM memory stacks, high-speed networking, and soon co-packaged optics and edge AI devices.
Teradyne Enables Scaling the AI Data Center
Teradyne is the quality gate across all of it, from wafer to data center, ensuring the most advanced chips perform as designed. We don’t just test chips, we de-risk the AI buildout. And with multiple demand waves still ahead, this is a multi-year transformation.
Click the insertion image or test category bar to learn more about the Teradyne products that support it.
Product List: All Test Categories
Filter by Insertion:
Wafer
Die
Substrate
Package
PCB
Tray
Rack
AI Data Center
Filter by Test Category:
ATE TestCompute, Networking, Power, Memory
Optical Test
Integrated System Test
Storage Test
Storage Test
High Speed Interconnect Test
Production Board Test
Robot Assisted Test, Assembly & Operations
ATE Test
UltraFLEXplus
WaferDieSubstratePackage
High-performance test platform for AI accelerators, custom ASICs, and mobile SoCs.
ETS-800
WaferDieSubstratePackage
Precision test for power semiconductors enabling AI data center power delivery and automotive applications.
Magnum 7H
WaferDieSubstratePackage
Production test for HBM, DDR5, and next-generation AI memory devices.
Optical Test
Photon 100
WaferDieSubstratePackagePCB
High-volume opto-electric test for silicon photonics and co-packaged optics.
Quantifi Photonics
WaferDieSubstratePackagePCB
Photonic and high-speed electrical test for silicon photonics and optical transceivers.
System Level Test
Titan HP
SubstratePackagePCB
System-level validation for high-power AI compute packages under real operating conditions.
Storage Test
Saturn HD
PackageRackAI Data Center
High-throughput production test for near-line hard disk drives powering AI data center storage.
HSIO Test
MultiLane Test Products
PackagePCBTrayRack
High-speed interface test for cables, transceivers, and interconnect silicon.
Production Board Test
Omnyx
PCBTray
Structural, parametric, and high-speed interconnect test for AI chip assemblies.
Robotics Test
Universal Robots
PCBTrayRackAI Data Center
Collaborative robot arms automating assembly, test, and operations in semiconductor and electronics production.
Mobile Industrial Robots
PCBTrayRackAI Data Center
Autonomous mobile robots (AMRs) moving materials through semiconductor fabs, warehouses, and data center operations.
Teradyne Device Interface Solutions is now DIS Tech.
You are now being redirected to the DIS Tech website.
Wafer
Die