Test Cell Solutions: Enabling Semiconductor Wafer and Package Test
As the leading provider of complete Test Cell Solutions and services, we at Teradyne leverage our expertise, experience, and technology leadership to help our customers achieve the highest yield and the highest throughput in production with the fastest time to market. We partner with you in your journey from design to production to provide standard and customized test cell products and services.
We begin with an evaluation of your test cell needs to provide a customized solution that addresses your challenges. In working and coordinating with the industry leading prober, handler, contactor, and probe head suppliers, we can design and deploy the integrated Test Cell Solution with the automatic test equipment (ATE) to provide the fastest time to production. In order for our customers to continue benefiting from our Test Cell Solutions, we offer world-leading maintenance and service support for our solutions.
We Provide an Integrated, Validated Solution for Wafer and Package Test
Wafer Test Solutions
Teradyne’s probe interface solutions allow our testers to dock to a variety of industry-leading device probers. We provide our customers the most cost-effective wafer test solutions in collaboration with the leading prober companies by using our configurable interface architecture. Our interfaces support:
- Bottom Load Towered Interface
- Top Load Towered Interface
- Towerless Interface
Package Test Solutions
When you work with Teradyne to develop a package test solution for your next generation advanced packaging device, you benefit from years of experience. We bring expertise and knowledge from working with the world-leading handler companies along with solutions proven in more than a 1,000 test cells across the globe. Our handler interface solutions allow Teradyne testers to dock to a variety of device handlers including:
- Standard Device Under Test Up Handler Interface
- Standard Device Under Test Vertical Handler Interface