Optical Test
Modular Test Solutions for Silicon Photonics, Co-Packaged Optics, and MicroLED
Optical interconnect is moving inside the package. As silicon photonics, co-packaged optics, and microLED become foundational to AI and data center architectures for both scale up and scale out, optical measurement is moving out of the lab and onto the production floor, where it has to run at volume alongside electrical test.
Teradyne has a portfolio of optical test solutions that span the entire product lifecycle, from design verification through high-volume manufacturing. Leveraging a robust ecosystem of partners, our solutions address the unique challenges of both optical and electrical test, helping customers reach production faster and with higher yield.
Optical Interconnect is Powering the Future of Semiconductors
Networking power has become the limit on AI data center scale, and moving the optical interface into the package is the strategy the industry has converged on. Silicon photonics and co-packaged optics carry high-bandwidth traffic on a small number of very fast lanes, used today for both scale up and scale out applications. microLED takes the opposite approach for short reach, typically scale up applications, running many parallel low-speed lanes at a fraction of the power and latency, including across the GPU-to-memory paths copper constrains today.
Both create new test challenges. Optical and electrical signals have to be measured in the same insertion, at wafer, at die, and at the finished module, with the alignment precision and automation that volume production demands. Teradyne brings both into a single test cell, improving yield as the industry shifts toward high-volume manufacturing of these complex packages.
Teradyne optical test solutions span design verification through volume manufacturing, and include:
Quantifi Photonics Photonic Integrated Circuit Test Solutions
Quantifi Photonics is a leading provider of innovative test solutions designed to help customers unlock scalable and cost-effective high-volume manufacturing of silicon photonics and photonic ICs (PICs). The company’s test portfolio includes a broad range of photonic test instruments and digital sampling oscilloscopes in benchtop and PXI form factors. This flexible architecture supports high-density, parallel testing at all stages of the product lifecycle, with a focus on design verification and volume manufacturing.
Photon 100
By integrating advanced optical and electrical instrumentation with the UltraFLEXplus platform, the Teradyne Photon 100 delivers high-throughput, automated testing across wafer, optical engine, and co-packaged module stages. This streamlines operations, accelerates time-to-market, and supports scalable silicon photonics manufacturing, while providing the option to leverage existing UltraFLEXplus hardware.
Iris 100
By combining a precision optical stack with six-axis fine alignment, the Teradyne Iris 100 delivers accurate, absolute optical measurement of microLED devices at production throughput. Absolute measurement correlates results across test cells, turning production test into process control as microLED volumes scale.