Magnum E2

Next-Generation, High-Speed Memory Test System for Advanced DRAM and Flash Interfaces 

Teradyne’s Magnum E2 is a next-generation high-speed memory test system for advanced DRAM and flash interfaces, including LPDDR6, DDR6, GDDR7 and NAND flash. Built on Teradyne’s proven Near-DUT Test (NDT) architecture, the foundation of the widely deployed Magnum EPIC platform, Magnum E2 supports both production and engineering configurations, covering qualification through high-volume manufacturing on a common hardware and software platform.

AdvantagesApplications & Configurations

Higher Yield at Speed

Near-DUT digital instrumentation delivers superior signal integrity to strengthen at-speed test performance and help maximize device yield.

High Parallelism on a Common Platform

Perform at-speed testing across DDR, LPDDR, GDDR and NAND flash devices. Scalable production and engineering configurations support qualification through high-volume manufacturing on a common hardware and software platform. 

Future-Ready Protocol Coverage

Support for high-speed NRZ, PAM3 and PAM4 signaling with a flexible, programmable algorithmic pattern generator (APG) architecture on common hardware accommodates current and emerging DRAM and NAND flash standards without requiring tester replacement. 

Memory and Logic Test on a Single Platform

Built-in logic test capability supports the convergence of memory and logic testing, enabling customers to consolidate test insertions and reduce overall program complexity. 

Application Coverage

  • Advanced DRAM interfaces – LPDDR6, DDR6 and GDDR7
  • High-speed NAND flash for enterprise SSDs

Configuration

  • Up to 64 test sites and 24.5K high-speed I/O pins
  • Production configuration for high-volume manufacturing
  • Engineering configuration for qualification and test program development
  • Common hardware and software platform across both

Built for the AI Era, from the Data Center to the Edge

As AI drives successive generations of memory innovation from the AI data center to the edge, the ability to test at higher speeds, with flexible interface signaling at higher parallelism, and across a broader protocol range is a necessity for memory manufacturers. Magnum E2 gives Teradyne’s customers the platform to meet that challenge today and evolve with confidence as the industry moves forward.