Test System Optimized for High-Performance Digital and SoC

Delivering superior economics and fast time to market with the industry’s highest rated software, the UltraFLEX test system has the power and precision you need for complex SoC devices. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count.

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  • Applications
    • Mobile Application Processor
    • Digital Baseband Processors
    • High Data rate RF Transceivers
    • RF Connectivity Devices
    • mmWave
    • 5G
    • Mobile Power Management ICs (PMIC)
    • MicroProcessors
    • Network Processors
    • High Speed SERDES (SERializer/DESerializer) and backplane transceivers
    • Storage Controllers
    • High End Microcontrollers
    • Audio and Video Processors
  • Advantages
    • Superior flexibility, throughput and scalability. UltraFLEX scales from low pin count, analog-dominant devices to massive parallel test of high-end processors with superior parallel test efficiency with low tester measurement overhead for maximum throughput. The UltraFLEX offers features such as SyncLink control of all tester operations from a digital pattern, Background DSP (digital signal processing) with automatic data download up to 32 dedicated processing cores, and System Data Broadcast to minimize instrument setup time.
    • Maximum test quality and yield. The UltraFLEX performance allows integrated circuit producers to meet the conflicting goals of "zero” defect rates and maximum device yields. UltraFLEX provides the widest range of coverage with gigahertz speeds and precision measurement for analog, digital and RF testing. Digital and DC options offer competitively unmatched timing and voltage accuracy. Our high port count RF performance exceeds the capability in the best bench instruments. 
    • Faster time to Production. Teradyne’s breakthrough IG-XL software speeds time to market and reduces cost of test by transforming test program development.  It is easy to learn, easy to use, and far less error-prone than competitive software, providing the highest quality results with a minimum amount of time and manpower.
  • Configurations

    The three available UltraFLEX base systems allow customers to optimize capital cost, floor space and maximum resource count. All three versions will accept the same DIBs (Device Interface Boards) for application portability and use exactly the same instrument options for the most effective capital reuse and production flexibility. All heads feature a universal slot architecture, which allows any instrument to be installed in any slot.

    The UltraFLEX test heads utilize SureMate® connections to the DIB which provides easy system reconfiguration and optimum instrument performance at the applications interface. Liquid cooling of high-density instrumentation also guarantees consistent hardware performance and increased reliability.


    • 12-slot system


    • 24-slot system


    • 36-slot system
  • System Options

    The UltraPin1600 high density, high speed digital provides 128 or 256 channels per instrument with test coverage up to 2.2Gbps. The UltraPin1600 implements Teradyne’s groundbreaking multicore, hardware-based Protocol Aware capability that allows individual pin groups to be slaved to device data rate and timing and eliminates the need for digital patterns for programming standard data busses.  Proprietary hardware for same-cycle source synchronous capability and “walking strobe” timing measurements provides production test capability for high speed DDR and other critical applications when needed. The UltraPin1600 is also test program compatible with the earlier UltraPin800 and HSD1000 digital options.

    The UltraWave12G/UltraWave24 high port count RF options provide up to 96 universal, vector RF ports with carrier frequencies and modulation bandwidths to cover the most advanced cellular and connectivity standards. The UltraWave options offer accuracy and phase noise performance equal to or better than the highest performance bench equipment available and integrate waveform sourcing and capturing onboard to eliminate the need for extra tester instruments. The UltraFLEX ESA software toolkit and UltraDSP1 option provide industry-standard modulation and demodulation tools running on up to 32 dedicated processing cores with automatic data download via a dedicated high speed data bus for simple correlation to industry standards and the highest possible throughput.

    The UltraWaveMX44 and UltraWaveMX20 instruments enables faster time to market and higher product yields for semiconductor devices used in emerging mmWave applications. The MX44 and MX20 extend the UltraWave24 capability for full test coverage of IoT, WiFi, LTE, Ultra Wideband, and 5G standards while maintaining full DIB and docking compatibility.

    The UltraPAC80 high density AC source and capture instrument offers up to 8 source and capture channels, each with dedicated audio and video analog paths. Teradyne’s proprietary sample clock architecture provides the user with complete sample frequency flexibility without performance compromise and guaranteed phase alignment to every other instrument on every run of the test program to eliminate the need for job-specific calibration to achieve the phase balance required for the highest performance RF transceivers.

    The UltraVI80 high pin count, high accuracy voltage and current option provides 80 independent pins of “3-in-1” capability.  Each UVI80 pin is a true voltage or current (VI) source and measure instrument complete with ultra high-accuracy differential voltmeters and time measurement units available to each pin for complete, massively paralleled testing of mobile power management devices. In addition, UVI80 channels can operate in a special, low-droop voltage source mode that offers unmatched power supply noise performance for sensitive analog and RF applications. Finally, each UVI80 channel has an embedded high performance AC waveform source and measure capability for highly paralleled test of D/A and A/D converters embedded in complex SOC or microcontroller devices.

    The UltraVS256 high density Device Power Supply (DPS) provides 256 independent channels per instrument to provide the massively paralleled capability required by low power mobile communications devices. The UVS256 also offers a clamp-based current source capability for device parametric testing.  The UVS256 provides test engineers with the capability of programmable output bandwidth and full pattern setup and measure control that results in reduced DIB complexity and faster test times.

    The HEXVS and VSM Ultra High Accuracy and Stability Processor Core Supplies improve performance and yield of complex processors by offering unmatched voltage accuracy and stability under load. This allows devices to be configured for maximum performance at lower voltages, increasing the value and yield of devices tested on UltraFLEX.

    The DC30 and DC75 voltage/current supplies extend DC capability to 30 volts and 75 volts to address high voltage test requirements of of mobile power management and other devices. Like the UltraVI80, both options contain a precision differential voltmeter and time measurement capability.

    The UltraSerial10G high speed, high port count serial digital option provides up to 20 ports (80 pins) of SERDES capability to 10.7Gbps, which can be extended to over 40Gbps using configurable data rate extension options. It also uses the same multicore, hardware-based Protocol Aware capability and the standard digital pins to completely and automatically emulated high speed interfaces such as PCI Express, Serial-ATA with no low-level programming required by the user.

    The UltraSerial60G is the first ATE solution for testing 60Gbps high-speed devices. Designed for device characterization and production test on UltraFLEX, the instrument has 32 TX and 32 RX differential ports, enabling the industry’s highest parallelism. UltraSerial60G also has 32 independent built-in digitizers that ensure bench-top test quality with no additional DIB circuitry. 

    The UltraPin4000 high speed, high precision digital option offers extremely high data rate capability with proprietary timing calibration options that allows unmatched timing accuracy to test the most challenging DDR interfaces on roadmap processors.

  • Software

    IG-XL-245x100-TeradyneTeradyne’s award-winning IG-XL Software transforms test program development. Its powerful, yet easy-to-use, graphical environment lets engineers rapidly develop fully functional test programs, cutting program development and debugging time. Designed to address multisite complexity, IG-XL can convert single site test programs to multisite automatically, speeding time to market and reducing cost of test. With IG-XL, test engineers focus on actual testing, not writing code for the tester.

    Learn more about IG-XL Software.