UltraFLEXplus
The World’s Leading Semiconductor Test Platform
The UltraFLEXplus combines new instrument and software capabilities with a revolutionary tester infrastructure that provides a step-function improvement in throughput and engineering efficiency – all while leveraging the cumulative test IP developed over the UltraFLEX’s long history.
Advantages
Fastest Time to Production
IG-XL software compatibility and the new Broadside Applications Interface enables test engineers to be more productive from the start and reduce the time to production by more than 20%.
Highest Throughput
The new UltraFLEXplus architecture increases site counts and improves parallel test efficiency, increasing overall throughput and reducing the number of test cells required by 15%-50%.
Scalable Architecture
The UltraFLEXplus can be redeployed for multiple product lines and upgraded for future product requirements, increasing reuse and extending the asset’s useful life.
Applications
- Mobile Application Processor
- Digital Baseband Processors
- High Data Rate RF Transceivers
- RF Connectivity Devices
- mmWave
- 5G
- Mobile Power Management ICs (PMIC)
- Microprocessors
- Network Processors
- High Speed SERDES (SERializer/DESerializer) and Backplane Transceivers
- Storage Controllers
- High-end Microcontrollers
- Audio and Video Processors
Configurations
The UltraFLEXplus has 3 base systems that allow customers to optimize capital cost, floor space and maximum resource count. All three versions utilize the Broadside DIB for higher density, higher site counts, and simplified routing.
UltraFLEXplus Q24
24-slot system
UltraFLEXplus Q12
12-slot system
UltraFLEXplus Q6
6-slot system
Suite of New High Performance Third Generation Instruments
Digital Instruments
UltraPin2200 – Next Generation Digital Instrument
- High density, 512 channels per instrument
- 32 pattern generators per instrument for concurrent test or unique pattern flows per site
- Proprietary, hardware-based protocol aware capability
- Dedicated memories for non-deterministic data testing
- Up to 16Gbit scan test capacity with a flexible pattern memory architecture
- Data sharing across sites
DC Instruments
UltraVS256-HP – High Density, Highly Flexible General-purpose Device Power Supply
- 256 channels per instrument
- Flexible merge capability
- Excellent dynamic performance
- Low noise
- Four quadrant voltage or current source and measure
UltraVS64 – Next Generation Core Power Supply Instrument
- Extremely accurate, stable resource for device core supplies
- Unmatched dynamic performance
- <1mV 6 Sigma voltage accuracy
- Up to 320 Amps of device power per instrument
- Merge up to 1,600A for a single supply
- Supports instantaneous system-wide current steps of up to 2,560 Amps
UltraVI264 – High Precision, High Density DC Instrument
- 104 low voltage channels muxed to 248 connections
- 8 high voltage channels muxed to 16 connections
- Flexible channel merge for USB charging standard
- High precision DC measurements
RF Instruments
- 8 independent sources and 8 independent receivers per instrument
- 32 bi-directional ports per instrument
- Frequency coverage from 50 MHz to 24 GHz
- State of the art error vector magnitude (EVM) and phase noise performance
- Configurable to offer optimized performance and cost of test
- 500 MHz I/Q bandwidth support
- 16 differential source and 16 differential capture channels per instrument
- Excellent error vector magnitude (EVM) performance with -50 dB typical for WiFi 7
- Per pin parametric units (PPMU) function
AC Instruments
UltraPAC300 – Next Generation High Density Analog Instrument
- High performance audio and baseband AC instrument
- Coverage up to 300MHz
- Dual mode high speed and high-resolution channels
UltraCTO384 – High performance, High Density Converter Test Option
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128 source channels, 128 capture channels, and 128 reference channels
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Single ended and differential embedded converter test up to 16 bits of resolution
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Sine and smooth ramp generation for at-speed testing
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+/-50uV voltage measurement accuracy for device trim
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DUT voltage sense for both source and reference
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Integrated source to reference calibration minimizes DIB circuitry requirements allowing for high sitecount
High-Speed I/O (HSIO) Instruments
UltraPHY: Complete PHY Performance Test Coverage
UltraPHY 224G
- 8 full-duplex differential lanes + 8 Rx-only differential lanes per instrument
- Test data rates up to 112 Gb/s NRZ and 224 Gb/s (112 Gbaud) PAM4
- High density at extreme data rates; supports multiple instruments per UltraFLEXplus tester
- Coexists with other industry-leading UltraPHY instrument variants on UltraFLEXplus
- DSO + BERT architecture for comprehensive PHY production test and characterization
- Unified workflow via Teradyne’s widely adopted IG-XL software
- Supports most eye-related measurements for PAM4 and NRZ, such as height, width, TDECQ, etc.
- Example use cases: PCIe Gen 7, OIF CEI-224G, CXL, Silicon Photonics (SiPHO), and more
UltraPHY 112G
- 16 full-duplex differential lanes
- Test data rates up to 64 Gb/s NRZ and 112 Gb/s (56 Gbaud) PAM4
- High density; scales to multiple instruments per UltraFLEXplus tester
- Coexists with other industry-leading UltraPHY instrument variants on UltraFLEXplus
- AWG + DSO architecture for comprehensive PHY production test and characterization
- Unified workflow via Teradyne’s widely adopted IG-XL software
- Enhancement path to UltraPHY 224G, future-proofing the investment
- Supports most eye-related measurements for NRZ and PAM4, such as height, width, SNR, etc.
- Example use cases: PCIe Gen 1- Gen 6, OIF CEI-112G, IEEE 802.3ck Ethernet, Silicon Photonics (SiPHO), and more
The UltraFLEX Family
Leveraging our customers’ existing investment, the UltraFLEX family of testers strives to reduce the engineering effort required to develop and deploy new test programs with comprehensive instrumentation and our IG-XL software, an industry standard with over 10,000 active programmers that has been continually enhanced over UltraFLEX’s long history.
As the leading provider of complete test cell solutions and services, we at Teradyne leverage our expertise, experience, and technology leadership to help our customers achieve the highest yield and throughput in production with the fastest time to market. We partner with you in your journey from design to production to provide standard and customized test cell products and services.