Device Interface Solutions

You may have been familiar with Teradyne’s Global Services Organization (GSO), the number one supplier of interface hardware for Teradyne testers. Device Interface Solutions (DIS) is still that same award-winning organization; but as the design and manufacturing of Device Interface Boards (DIBs) has become more complex, we evolved with that change and formed a dedicated DIS group. So, our name has changed from GSO to DIS, but we’re still Teradyne and still the trusted partner customers depend upon to maximize production test performance, reliability, and efficiency.

What DIS Offers

The die contained in a packaged semiconductor device is tested in wafer form at probe test and then tested at final test after packaging. These different test insertions require different types of device interface boards: a probe card (PC) with an integrated probe head & needles that touch down on the wafer before packaging, and the final test (FT) board that includes sockets specific to the packaged IC shape & size and is integrated with the packaged device handler. DIS provides the expertise to design, fabricate, and assemble these types of boards, as well as prober interface boards (PIBs).

For wafer test, DIS provides the expertise to produce DIBs that meet the test cell requirements for the the probe needle interface to be extremely flat, provide the ability to handle high pin count and high site count devices, deliver the performance of the tester signals, and be able to accommodate the fine pin pitch requirements of the die.

At final test, the interface board needs to withstand the high insertion forces exhibited when devices are inserted into the contactors while meeting the high pin count, high site count and signal integrity requirements of today and tomorrow’s test applications.

What Makes Teradyne’s DIS Different?

Teradyne, the number one rated ‘Best Chip Making Equipment Supplier of 2019’ by VLSIresearch, delivers the latest generation of tester capability and Teradyne’s DIS organization provides the interface hardware to take advantage of all that the newest generation of Automated Test Equipment (ATE) has to offer.

Our Hardware Research & Development center is co-located with our instrument development team in the U.S. This powerful combination enables DIS to provide superior electrical design capability for fully optimized power and signal integrity. Simply put, this means unequaled electrical design for our customers to achieve maximum performance for their new device production testing.

We understand you need to get more complex devices to market faster without compromising quality. That’s why DIS provides highly complex interfaces with a class-leading first pass quality rate and consistent on-time delivery. Our customers trust us to bring their device into production on time and keep it running. DIS also offers Bin 1 services to minimize the installation time and maximize first-pass quality of delivered interface hardware, and in-production tools to monitor the health of your DIBs, provide diagnostic information related to any detected defects, and maximize the manufacturing lifetime of your expensive probe heads.

Teradyne understands the importance of shorter cycle times and better yields in device manufacturing— which is why DIS is focused on designing for manufacturing and reliability. We deliver a high first pass board yield so you can plan on a predictable delivery and installation schedule to support your IC bring-up and volume production ramp.

DIS uses advanced design technology to get you to your perfect design with shorter lead times. We offer advanced SiP (System in Package) design tool integration, automated full-board simulation capabilities, and extensive CAD tool automation for enhanced design and fabrication validation. Through these unique advances, combined with close co-development of manufacturing techniques and design rules with our supply chain partners, DIS ensures first pass board yields of greater than 90%.

DIS is striving continuously to enable the highest site count possible final test and wafer probe applications to maximize your tester efficiency. Currently, DIS has the capability to design and fabricate interface boards with device pin pitch down to 60µm. With DIS as your partner for device interface hardware, we’re confident your production floor will be running with the highest efficiency possible.

What about test and diagnostics for new hardware designs? Teradyne is the leader in test and that’s our specialty. On-Tester DIB-Diagnostics are possible for every new interface board, providing high fault coverage with or without a shorted-socket/wafer contact point. An extension of these diagnostic tools that integrate with the production flow provide the ability to continuously monitor the ‘health’ of a device interface board enabling early detection and diagnosis of damaged or defective components and avoidance of production test running on un-characterized hardware performance – risking poor yields or test escapes impacting downstream performance and quality.

DIS is experienced in designing, simulating, and integrating MLO (Multi-Layer Organic) space-transformer technology which enables translation of the tester signals to the fine pitch requirements of the device pins. Implementation of this unique technology enables high site count wafer probe cards with good touch down efficiency (TDE).

How DIS Can Help Your Business

DIS provides you with local interface design expert resources and offers “turn-key” solutions for your interfacing needs, allowing your engineering team to focus on test development and ensuring you are able to take full advantage of the capabilities of Teradyne’s test platforms.

With over 200 global support personnel, we are a trusted partner providing local design for new device introductions. Teradyne’s experienced DIS design means our customers have a predictable hardware release schedule for mass production readiness.

If your goal is to optimize performance, quality, schedule, and total test cost for Device Interface Board (DIB) design and manufacturing, your best option is Teradyne’s Device Interface Solutions (DIS).