The 35th Teradyne Users Group (TUG) Conference was successfully held in Shanghai, China.

The 2018 Conference was the first TUG to be hosted outside of the United States, and attracted nearly 450 customers and Teradyne test experts from home and abroad. The event marked the rise of China's semiconductor industry, the improvement of local semiconductor testing standards and the determination of Teradyne to grow with local customers.

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The 2018 TUG Conference opened under the chairmanship of Dr. Rainer Fink, head of the TUG 2017-2018 Steering Committee. Dr. Fink is currently an associate professor in the Department of Electronic Systems Engineering and Biomedical Engineering at Texas A&M University, and is the director of Texas Instruments’ Mixed-Signal Testing Laboratory. Following Dr. Fink, Jason Zee, Vice President of Semiconductor Marketing at Teradyne, welcomed and thanked guests for attending TUG.

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The Conference arranged the keynote speeches of representatives of well-known enterprises in the industry and presented the market overview and product development roadmap of Teradyne. It also included paper presentations and sub-forums for technical exchange, covering the latest in testing techniques. The content of the technical sessions examined a wide range of IC, package, SOC, SIP and other solutions that are of interest to test engineering developers and manufacturers as well as applications in computing, communications, consumer electronics, automotive electronics, and memory. Additional discussion topics included the latest 5G/artificial intelligence/automobile electronics solutions and numerous technology sharing and experience exchanges with Teradyne users.

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The colorful TUG dinner delivered an unforgettable Networking Event to the attendees, giving new and old friends the opportunity to socialize. Another highlight of this year’s conference was the Vendor Fair. With 30 companies in attendance, it was the largest Vendor Fair in the history of TUG! The event offered vendors and partners the opportunity to engage with leaders in the ATE industry and the opportunity for new business.

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The TUG conference concluded with the announcement of the winners of the Best Paper Awards. The esteemed winners list included:

  • Michael Soliman, MaxLinear - Dual Tone Test Dilemmas Using an IQ Modulation Methodology
  • Vijay Anandan, Tessolve - Choosing the Right PCB Stackup Technology For Your Teradyne UltraFLEX Test Boards
  • Andreas Dressel, Texas Instruments - Capacitor Measurement on J750HD for HDDPS, HDAPMU, HDCTO and HSD800
  • Divya Hansraj, Texas Instruments - Balanced Test Technique for Elimination of Setup Induced Errors in Sensitive High Current Output Measurement Using Eagle 364 Tester
  • Maciej Miler, Texas Instruments - Low Leakage Measurements: With or Without APU-12?
  • Leo Di Bello, Teradyne - J750 Test Time Analysis With Only A Few Steps - The New Profiler
  • Tim Guo, Teradyne - How to Deal with DUT Nondeterministic Behavior Using nWire PA
  • Eric Peng, Teradyne - UFS Device Test Solutions Based On Magnum VU System
  • Kirk Pitta, Teradyne - Panel Level Packaging
  • Roger Sinsheimer, Teradyne - 56Gbps PAM4 and RF Together On UltraFLEX
  • Troy Zhang, Teradyne - Advanced Datalog Tool for Live Data Analysis

The TUG Conference further strengthened the cooperation and communication between Teradyne and its customers, suppliers and other partners. Being held in Shanghai, this year’s conference allowed many of Teradyne's customers, suppliers and employees in Asia to have the opportunity to attend TUG for the first time. The high-quality technical exchanges at TUG also benefited the participants. The attendees all expressed their gratitude for a well-run event and look forward to participating in Teradyne activities in the future.

Thank you again for you for all of those who participated in TUG and those who had a hand in making the event a great success! See you soon.

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