Mixed-Technology Test Systems

Mixed-Technology Test Systems

Integrated Advanced Test Capabilities for Missile, Radar, Electronic Warfare, and Space Applications

Address complex test requirements of today’s advanced electronics with Teradyne’s integrated and scalable Mixed-Technology test systems – a single test solution that saves time, increases efficiency, and maximizes your return on investment.

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Mixed-Technology Testing for Modern Aerospace and Defense Electronics

Modern aerospace and defense electronics have become highly sophisticated and increasingly integrated. Testing multiple technologies on a Unit Under Test (UUT) with mission-specific test systems is often inefficient and can lead to high cost of operation and maintenance.

Teradyne’s Mixed-Technology Test Systems address complex test challenges while offering a simplified, scalable, and cost-effective approach to testing in various manufacturing and product support environments.

Capabilities

Teradyne’s Mixed-Technology test systems are built on Teradyne’s standard, open architecture Spectrum test platforms, with integrated advanced test capabilities including:

  • High speed digital bus tests
  • Real-time storage and processing of high-bandwidth, streaming data
  • Optical interfaces
  • Complex digital/optical switching
  • Precision analog
  • RF instruments and subsystems
  • High fidelity automated RF switching

Scalability

Teradyne’s mixed-technology test solution is highly scalable. System flexible sizing and compatibility across platforms provide cost-effective approaches to handling multiple programs at multiple production and depot sites.

Advantages

  • Tests various advanced technologies with one test system
  • Increases test and TPS development efficiency. Reduces procurement, operation and maintenance costs
  • Reduces schedule risk and overhead cost with single trusted vendor
  • Maximizes return on investment with system scalability and long-term supportability
  • Teradyne can deliver Complete test solutions that solve any test-related problems

ETS-800 New

ETS-800

Next-generation Automotive Test Platform with the Industry’s Highest Throughput and Fastest Time to Market

The ETS-800 is designed with comprehensive functional test coverage including extensive analog and digital capability and provides automotive-level test quality. Its unique APEX architecture minimizes DIB complexity, reducing time from project start to production release and enabling high site count to ensure sustainable high throughput.

Advantages

Scalable Site Count

  • Unique Multi-sector Architecture
    • Enables near-zero effort program scalability to high site count.
    • Supports up to four sectors, typically configured in a symmetrical fashion to enable site count scalability up to 1024 total sites.
  • Fast and easy capacity expansion when device volumes increase with support for a wide range of site counts and easy upgradeability to higher site counts

Highest Throughput

  • Fast PCIexpress communication infrastructure, optimized API’s and extensive test time profiling tools result in the shortest test times in the industry
  • Multi-sector Architecture delivers high parallel test efficiency with no effort from the test engineer
  • The largest applications space available, plus the APEX architecture’s integrated matrices & muxes enables maximum site count.

Fastest Time to Market

  • Mature, stable & powerful EV-MST Software enables test engineers to develop test programs efficiently.
  • Multi-sector Architecture allows engineers to focus on single or low site count program development and scale to a high site count program with near-zero effort. High parallel test efficiency is achieved automatically.
  • The APEX architecture reduces relays by an order of magnitude, enabling simpler dibs, higher site count and shorter development times.

Automotive-level Test Quality

  • Precision instrumentation and conservative, guaranteed specifications deliver stable results that are repeatable from tester to tester and device to device.
  • Comprehensive, integrated alarm infrastructure ensures every device pin receives the intended stimulus.

Applications

Industrial Power Management

  • Smart power stages, low dropout regulators, DC-DC converters, voltage regulators, boost regulators, mult-phase PWMs, battery chargers, hot swap power managers, gate drivers

Precision Analog

  • Op amps, instrument amplifiers, video amplifiers, audio amplifiers

Automotive Analog

  • BMS monitors, fuel injectors, ABS controllers, airbag controllers, automotive smart switches, CAN transceivers, motor drivers

Mobility

  • USB chargers, wireless chargers, PMICs

Configurations

The ETS-800 test platform is designed with a unique Multi-sector Architecture making the system inherently scalable in terms of site count, with up to 1024 total sites. The system supports up to four sectors and each sector represents a complete mixed-signal multisite test system capable of testing a wide variety of products.

Production systems are controlled via a single multi-core test computer and may be populated with one, two, or four sectors based on the desired maximum site count.  Engineering systems support simultaneous, independent multi-engineer development.

Instrument Options

HSD-32 Performance Digital

  • 32 channels
  • Data rate 200MVps
  • -2V to +12V, 32mA PPMU

UPD-64 Universal Digital / VI

  • 64 channels
  • Data rate 20MVps
  • -1V to +24V, 50mA PPVI
  • APEx Dual 2-by-8  force/sense DC muxing
  • Supports +/-120V, 1A DC / 4A pulse

APU-32A  Floating Low Power VI

  • VI channels
  • -30V to +80V, 200mA VI
  • Src/Cap/AWG per channel
  • APEx 4:2×8 matrices w/4A pulsed operation

SPU-8112A Floating High Power VI

  • 8 high bandwidth VI channels
  • +/-100V, 2A DC, +/-12.5A pulse per channel, gangable to 100A
  • 20bit audio source & capture
  • APEx: A/B output mux

SPU-500 Floating High Voltage VI

  • 2 VI channels
  • +/-500V, +/-50mA per channel

QMS Precision Digitizer

  • 4 differential VM’s
  • Fully floating per-channel
  • Four precision (12-bit at 10 Msps or 16-bit at 200 ksps) independent floating differential volt meters that support AC and DC measurements up to +/-200V

QHSU High Speed AC

  • Quad 160 MSPS source
  • Quad 80 MSPS dig
  • Two fully independent dual channel high-speed signal analyzers capable of source or measure up to 50 MHz

SPU-2112A Floating High Power VI

  • 4 VI channels
  • +/-100V, +/-10A per channel
  • APEX: A/B output mux

SPMB SPU Booster/MUX

  • APEx 4 1×4 80V, 2A matrices, 12A pulse

MCMUX Mux Family Board

  • APEx 64 1×4 100V 2A Muxes, 12A pulse

Software

The ETS software development environment and tool set are truly one of the strongest attributes of the ETS-800 test system. The software tools are easy to learn and use, and are fully integrated into the Microsoft Visual Studio development environment. The complete test system command set is supported with automatic code generation tools (ACE™ and GrACE™). This means that users are not required to memorize command arguments and syntax. Graphical plotting tools are provided for simple point-and-click plotting of test-oriented waveforms. RAIDE™ (Rapid Access Interactive Debug Environment) makes it easy to view and change tester hardware settings.

In addition to native MST development tools a comprehensive portfolio of productivity tools – designed for applications engineers, by applications engineers, are available to enable efficient program development.

ETS-800 software provides a robust test development environment, offering customers an easy learning curve and uncommon productivity. With Multi-sector technology, EV-MST allows users to replicate test programs across multiple test head sectors.

Key Features

  • Simultaneous independent applications in engineering mode
    • Up to 4 engineers can develop independent test program simultaneously
  • Nearly 100% multisite efficiency across sectors with zero applications effort

As the leading provider of complete Test Cell Solutions and services, we at Teradyne leverage our expertise, experience, and technology leadership to help our customers achieve the highest yield and the highest throughput in production with the fastest time to market. We partner with you in your journey from design to production to provide standard and customized test cell products and services.

Spectrum RF Systems

Spectrum RF Systems

Scalable Test Solution for Mixed-Technology Test Applications

The Spectrum RF Systems are fully integrated, configurable test platforms combining several digital, analog, RF, and switching instruments to provide automated functional test solutions for a wide range of mixed-signal and microwave test applications including radars, Electronic Warfare, missile, and satellite communications.

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Standard Instruments

  • Teradyne’s software-defined, multi-functional eDigital instrument
  • Teradyne’s high-performance ZT-Series analog instrumentation
  • Teradyne’s High Speed Subsystem foundation, ready for Teradyne’s full suite of high-speed PXI/PXIe digital and complex bus instrumentation
  • Keysight Technologies’ industry-leading RF instruments

System Configurations

The standard Spectrum RF System configurations are optimized to support common test requirements for a mixed-technology Unit Under Test (UUT) with frequency range up to 26.5GHz. The platform’s flexibility, modularity, and open architecture allow the user to add test capabilities and configure the system to support unique UUT requirements.

Three standard configurations are available for different RF performance and form factor requirements.

Advantages

  • Fully integrated standard solution with common RF, analog, digital test capabilities
  • Proven performance, highly capable hardware
  • Supports a wide range of test applications throughout product life cycle
  • Highly scalable and expandable, ready to support future test needs
  • Single trusted vendor with decades of test expertise and long-term support commitment
  • Complete test solutions such as TPS and RFIU design, and TPS maintenance are available

Measurement Capabilities

Mixed-signal and microwave test applications up to 26GHz such as radars, Electronic Warfare, missile, and satellite communications. Measurement types include:

  • Frequency Response
  • Spectrum, Spurs, Harmonics
  • Third Order Intercept
  • S-Parameter
  • Analog Modulation and Pulse Modulation
  • Channel Isolation
  • Digital Functional Test
  • FLASH Programming
  • Boundary Scan
  • Analog Test
  • Switching
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Guardian™

Guardian™

Portable, Integrated O-Level Test Platform

Guardian is a ruggedized automated testing platform that quickly and accurately verifies the operational readiness of complex electronics systems in aircraft, ships, and vehicles.

With its software-defined, configurable architecture, Guardian supports a wide range of applications including electronic combat, communication, navigation, avionics, and control systems. The flexible design addresses rapidly evolving test requirements and allows for cost-effective long-term sustainment. 

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Guardian Front Facing Left

Highly Reconfigurable Architecture Supports Wide Ranges of Field Test Applications

Guardian’s architecture provides three levels of reconfigurability.

  • Hardware: Guardian supports up to four PXIe instruments, either reconfigurable or standard, providing endless test application possibilities. The chassis is removable, allowing users to easily swap instruments without having to disconnect cabling connections.
  • Interfaces: Guardian’s physical I/O panel can be configured and reconfigured to support a wide range of UUT interfaces. In addition, its Interface Board can accommodate additional interfaces and signal conditioning.
  • Software: Guardian’s instrument drivers, test programs, and touchscreen interfaces can all be configured using open software environment.

Guardian is an ideal solution for a multitude of O-Level test requirements in a single and secure package. Its ruggedized enclosure can operate in the harshest environments and meets the requirements for single person lift. The ergonomic design allows for easy handling and operation while the modular design provides hassle-free maintenance.

Instrument Options

  • HSSub PXIe Instruments– Software Defined, Application driven
  • Avionics PXIe instruments
  • Standard PXIe instruments
  • Non-PXIe and other unique instruments can be added. Visit Engineering Service to learn more about project-based solutions.

Applications

  • Military operational-level testing
    • Mission readiness verification at shipboard, airfield, forward operating base
  • Commercial aerospace flight-line testing
    • Data loading and operational tests
  • High-level assembly production testing
    • Functional tests
Guardian Front Straight On

Advantages

Can be configured to support a wide range of test applications.

Software defined, reconfigurable architecture to test requirement changes and future technology updates.

Guardian’s touchscreen and ergonomic design allows for easy single-person handling.

Compliant with MIL-PRF-28800F, MIL-STD-810G, and MIL-STD-1472G allowing use in the harshest environments.

Guardian is supported by more than 10 years of Teradyne product support and services, assuring cost-effective long-term deployment.

System Specs

Mechanical

  • Ruggedized Packaging. Meets
    MIL-PRF-2800F, MIL-STD-810G, and MIL-STD-1472G standards
  • System Dimensions (LxWxH) 14”x20”x12”
  • System weight 37.5 lbs single person lift

Computer

  • Secure Win10 SHB Operating System
  • Storage 500GB, 16GB DDR4 RAM Solid State Drive
  • Secure computer I/O.

Integrated Display

  • 10.7-inch touch screen display

UltraFLEXplus

UltraFLEXplus

The World’s Leading Semiconductor Test Platform

The UltraFLEXplus combines new instrument and software capabilities with a revolutionary tester infrastructure that provides a step-function improvement in throughput and engineering efficiency – all while leveraging the cumulative test IP developed over the UltraFLEX’s long history.

UltraFLEXplus soc tester

Advantages

Fastest Time to Production

IG-XL software compatibility and the new Broadside Applications Interface enables test engineers to be more productive from the start and reduce the time to production by more than 20%.

Highest Throughput

The new UltraFLEXplus architecture increases site counts and improves parallel test efficiency, increasing overall throughput and  reducing the number of test cells required by 15%-50%.

Scalable Architecture

The UltraFLEXplus can be redeployed for multiple product lines and upgraded for future product requirements, increasing reuse and extending the asset’s useful life.

Applications

  • Mobile Application Processor
  • Digital Baseband Processors
  • High Data Rate RF Transceivers
  • Mobile Power Management ICs (PMIC)
  • Microprocessors
  • Network Processors
  • High Speed SERDES (SERializer/DESerializer) and Backplane Transceivers
  • Storage Controllers
  • High-end Microcontrollers
  • Audio and Video Processors

Configurations

The UltraFLEXplus has 3 base systems that allow customers to optimize capital cost, floor space and maximum resource count. All three versions utilize the Broadside DIB for higher density, higher site counts, and simplified routing.

UltraFLEXplus Q24
24-slot system

UltraFLEXplus Q12
12-slot system

UltraFLEXplus Q6
6-slot system

Suite of New High Performance Third Generation Instruments

Digital Instruments

UltraPin2200 – Next Generation Digital Instrument

  • High density, 512 channels per instrument
  • 32 pattern generators per instrument for concurrent test or unique pattern flows per site
  • Proprietary, hardware-based protocol aware capability
  • Dedicated memories for non-deterministic data testing
  • Up to 16Gbit scan test capacity with a flexible pattern memory architecture
  • Data sharing across sites

AC Instruments

UltraPAC300 – Next Generation High Density Analog Instrument

  • High performance audio and baseband AC instrument
  • Coverage up to 300MHz
  • Dual mode high speed and high-resolution channels

UltraCTO384 – High performance, High Density Converter Test Option

  • 128 source channels, 128 capture channels, and 128 reference channels

  • Single ended and differential embedded converter test up to 16 bits of resolution

  • Sine and smooth ramp generation for at-speed testing

  • +/-50uV voltage measurement accuracy for device trim

  • DUT voltage sense for both source and reference

  • Integrated source to reference calibration minimizes DIB circuitry requirements allowing for high sitecount

DC Instruments

UVS256-HP – High Density, Highly Flexible General-purpose Device Power Supply

  • 256 channels per instrument
  • Flexible merge capability
  • Excellent dynamic performance
  • Low noise
  • Four quadrant voltage or current source and measure

UVS64 – Next Generation Core Power Supply Instrument

  • Extremely accurate, stable resource for device core supplies
  • Unmatched dynamic performance
  • <1mV 6 Sigma voltage accuracy
  • Up to 320 Amps of device power per instrument
  • Merge up to 1,600A for a single supply
  • Supports instantaneous system-wide current steps of up to 2,560 Amps

UVI264 – High Precision, High Density DC Instrument

  • 104 low voltage channels muxed to 248 connections
  • 8 high voltage channels muxed to 16 connections
  • Flexible channel merge for USB charging standard
  • High precision DC measurements

The UltraFLEX Family

Leveraging our customers’ existing investment, the UltraFLEX family of testers strives to reduce the engineering effort required to develop and deploy new test programs with comprehensive instrumentation and our IG-XL software, an industry standard with over 10,000 active programmers that has been continually enhanced over UltraFLEX’s long history.

As the leading provider of complete test cell solutions and services, we at Teradyne leverage our expertise, experience, and technology leadership to help our customers achieve the highest yield and throughput in production with the fastest time to market. We partner with you in your journey from design to production to provide standard and customized test cell products and services.

Reconfigurable Instruments & Subsystems

High Speed Subsystem

Software-defined, Reconfigurable Solutions for High-Speed Digital Test Applications

HSSub™ is a software-defined family of PXIe Instrumentation that can be integrated and scaled to support digital test applications throughout the product life cycle from design verification to production and sustainment.

HSSub instruments are configured via software, allowing them to easily adapt to test requirement changes and eliminate the need to add instruments to support system upgrades. The modular and open architecture enables equipment reuse, easy addition and expansion of test capabilities, and cost-effective long-term deployment.

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Adaptive and Flexible Architecture Supports A Wide Ranges of Test Applications

HSSub architecture consists of three main components:

  • HSSub Apps Software controls HSSub instruments and provides reconfigurable test functionality and programming API for test development
  • HSSub TriFlex™ Software integrates and manages HSSub instruments and support modules while coordinating communication to the host test system
  • HSSub PXIe Reconfigurable Instruments programmable via HSSub App software to support a variety of test requirements and configurations

This architecture allows HSSub  to perform complex, high-speed and low latency test interactions with UUT as a distributed capability in a test system or as an autonomous subsystem.

The HSSub family of hardware and software provides a wide range of digital test capabilities, standard or unique, that can support many commercial and defense test applications such as AESA radars, communication network and switches, satellites, electronic warfare, missile guidance and targeting systems, streaming data, videos and displays.

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HSSub Instrument and HSSub App

  • Reconfigurable Instruments – Reconfigurable FPGA-equipped serial bus and parallel digital instruments
  • Reconfigurable Flexible IO Instruments (FIOXI) – Reconfigurable FPGA-equipped instruments with flexible physical interfaces to support many different I/O types
  • Standard Bus Instruments – Widely used standard serial bus instruments
  • Support Modules – Additional hardware that provides extended test capability to the HSSub instruments, including real-time processing, optical conversion, data storage, and PXIe instrument use outside of the chassis.
  • HSSub Apps – Software that defines HSSub instrumentation test applications

Supported Test Applications

  • Dynamic Digital
  • Boundary Scan tests
  • Fast flash programming
  • Streaming data test
  • Optical switching and power control
  • Video capture and pattern generation
  • High-speed Serial up to 25 Gbps
  • High-speed Parallel LVDS up to 800 Mbps
  • Military bus emulation and test

Supported Bus Types

  • Fibre Channel
  • SMPTE 292
  • ARINC 818
  • PCI
  • PCIe
  • SFPDP
  • LVTTL
  • LVDS
  • I2C
  • RS485
  • RS422
  • RS232
  • IRIG-B
  • PRBS
  • ARINC 708
  • HOTLink
  • AS5643 FireWire
  • Ethernet 10M, 100M, 1G, 10G, 25G
  • USB
  • eSATA
  • MIL-STD-1553
  • ARINC 664
  • ARINC 429

Unique Test Applications

  • Teradyne offers test application development and training services. Visit Engineering Service and Total Test Solution to learn more
  • HSSub App development tools are available for customers looking to build their own HSSub Apps for unique bus test

Deployed Applications

  • Ruggedize Ancillary Kit for military ATS
  • Factory automation supporting Environmental Stress Screening (ESS)

Advantages

HSSub reconfigurable software-defined instruments provide endless test application possibilities and address rapidly evolving and emerging requirements

HSSub Apps leverage open architecture for TPS standardization and reuse, providing seamless transitions from test development to operation and maintenance

HSSub is modular, can be integrated into a system or subsystem and scaled to support all test phases of a product life cycle

HSSub’s proven reliability and Teradyne’s experience and commitment to long-term support assure cost-effective long-term deployment

System Options

Integrated Subsystem

  • 19-inch Rackmount with Virginia Panel G20 Interface
  • HSSub Remote Test Head
  • HSSub Optical I/O Interconnect

Ruggedized Subsystem

  • Mil-spec Ruggedized Packaging

Integrated Systems

ETS-200T

ETS-200T

The ETS-200T discrete test platform is built on proven ETS technology and provides true index-parallel testing specifically for turret and rotary handlers. These test systems maximize throughput with pattern-based test techniques based on SmartPin™ technology coupled with the use of dynamic Cbits for enhanced user control. The ETS-200T provides a complete test solution from wafer sort to final test for MOSFETs, including integrated control and datalogging for UIL, dVSD, Qg and LCR meter.

eagle test systems ETS-200T

Advantages

Raptor Software

Prewritten subtests help users avoid programming limitations commonly found in many discrete test systems.

Integrated with rotary and turret handlers for a complete final test discrete solution.

Integrated help file provides a detailed description of the test along with additional block diagrams and tool tips for optimizing test routines.

Applications

The ETS-200T test systems provide solutions with average site counts equal to or in excess of 16, with coverage of both DC and AC testing parameters. The robust software package combines pre-programmed routines for standardized tests with flexible programming tools for easy creation of customized tests. Completely integrated AC testing, including UIL Inductive Switching, Cg, Rg and Qg makes the 200T the ideal solution for both wafer and packaged device testing of discrete devices.

System Options

Platform scalability is key in the semiconductor test market, and ETS-200T test system uses the same floating analog resources as the ETS-88 product family and ETS-364.

DVI: digital V/I supports 16-bit voltage measurements up to +/-20 V with 0.61 mV resolution in 50us.

HPU-100: single channel V/I with 10 current ranges operating up to +/-100 V

SPU Family (100, 112, 500): suite of V/I’s capable of addressing a wide range of test requirements ranging from 100V / 2A to 500V / 50mA with fully AWG and digitizing capabilities per channel

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Software

Raptor includes a graphical user interface that allows fast programming and characterization with no language-based programming required. This innovative user interface allows users to directly input test conditions for a particular test and place the test in a user defined test flow. The pre-programmed test routines provide simple and easy to use methods for test programming that help users avoid programming mistakes and overcome limitations commonly found in many discrete test systems. The Raptor FT software suite increases test development productivity.

As the leading provider of complete Test Cell Solutions and services, we at Teradyne leverage our expertise, experience, and technology leadership to help our customers achieve the highest yield and the highest throughput in production with the fastest time to market. We partner with you in your journey from design to production to provide standard and customized test cell products and services.

eDigital-Series™

eDigital-Series™ Digital Test Instrumentation

PXIe digital instrument supporting parallel digital testing for LVDS technologies.

Defense and aerospace boxes and board designs frequently use low voltage TTL (LVTTL) and/or low voltage differential signaling (LVDS) technologies and often require boundary scan and parallel I/O flash programming test capability. eDigital-Series instruments provide flexible, parallel digital functional test for units under test (UUTs) employing logic voltages between -2V to +6V.

Teradyne’s eDigital IVI driver controls all parallel digital functional test parameters, including per-pin timing and voltage levels, data formats, pattern data, and timing alignment on 32 channels with up to 16M pattern depth and results memory.  Systems can achieve up to 544 synchronized channels using Teradyne’s Contact Free Air-Coupled Signal Technology (CFAST) using the newest instruments in the eDigital-Series.

eDigital-Series instruments also capitalize on the boundary scan, parallel I/O, and flash programming capabilities, which are often included on these newer UUTs. Packaged in a compact PXIe form factor, eDigital-Series instruments may be used as a standalone instrument or configured as part of an integrated HSSub system.

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Advantages

Superior LVTTL and LVDS digital test performance.
Its -2V to +6V digital channels feature 16MB pattern depth and results memory at up to 50MHz data rates across up to 544 single ended channels in a virtual instrument

Device programming via boundary scan and third-party boundary scan support.
Supports JTAG, Asset, Corelis, and Acculogic boundary scan tools.

eDigital software driver.
Provides full control of per-pin timing, data format and deskew across 32 single ended channels which can be programmed using modernized digital test editor (eDTE)

PXIe form factor.
Compact form factor maximizes performance density while reducing test system footprint.

Reliability and survivability.
High-density packaging and strict quality control including shock and vibration testing ensure low mean time between failure (MTBF) in the most rugged shipboard and mobile environments.

Worldwide support.
Available support services include 24-hour repair-and-return of defective parts, hotline telephone support, comprehensive training and documentation, and in-field calibration verification.

Applications

The eDigital-Series instrument family features a host of critical test capabilities that cover a wide range of applications.

eDigital-Series applications include:

  • Parallel digital test
  • Single-ended and differential digital test
  • Conventional, parallel I/O and flash programming via boundary scan I2C +SPI and PCI via HSSub App

Configurations

eDigital-Series is available as a standalone instrument or as a member of the HSSub instrumentation family:

Configuration choices include:

  • eDigital-6030
  • eDigital-6020A
  • eDigital-6025A
  • HSSub-6020
  • HSSub-6020 with funnel
  • HSSub-6025

System Options

Additional Capabilities and Accessories

  • Optional interface adapters and cables
  • Optional extended warranty/advanced replacement service

Di-Series™

Di-Series™ Digital Test Instrumentation

Integrated, standards based VXI instruments for digital test

Newer, higher performance defense and aerospace systems require increasingly rigorous digital testing. The VXI-based Di-Series multi-channel test instruments support these requirements with a powerful combination of performance, flexibility, usability, and reliability.

The Di-Series tests all levels of integration from board level (SRA/SRU) to box level (WRA/LRU) units under test (UUTs), while maintaining full compatibility with previous generations of Teradyne instrumentation and systems. Excellent usability and reliability reduce programming and support effort, as well as straightforward upgrades of existing test program sets (TPS).

Di-Series instruments are used in the U.S. Department of Defense (DoD) Standard automatic test system (ATS), U.S. Army IFTE, U.S. Navy eCASS, CASS, and RTCASS testers, U.S. Air Force VDATS, and Spectrum 9100 avionics test systems.

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di series digital test

Advantages

Superior performance.
Di-Series’ 50MHz speed, low voltage differential signaling (LVDS), and Quad-Detect™, which bands lower and upper limits of logic states, improve test quality, and decrease No Fault Found escapes.

LRU/WRA-Centric flexibility for bus-oriented digital tests.
Built-in capabilities, such as the Di-Series Handshake Engine, simplify asynchronous data transfer, improving test quality while reducing TPS programming time, complexity, and cost.

Unequaled usability.
Di-Series eliminates the need for shared resources with its independently programmed channels together with the iStudio™ graphic programming environment to speed TPS development and reduce cost.

Full compatibility.
Upgrade previous generations of Teradyne systems and instruments with the assurance that existing test programs are translated with proven TPS Converter Studio™ software.

Reliability and survivability.
High-density packaging and strict quality control including shock and vibration testing ensure low mean time between failure (MTBF) in the most rugged shipboard and mobile environments.

Worldwide support.
Available support services include 24-hour repair-and-return of defective parts, hotline telephone support, comprehensive training and documentation, and in-field calibration verification.

Applications

The Di-Series instruments feature a host of critical test capabilities that cover a wide range of applications.

Di-Series applications include:

  • Parallel digital test
  • Single-ended and differential digital test
  • Memory test
  • LRU/WRA test of new and legacy equipment
  • M9-Series and L-Series replacement

Configurations

Match Di-Series configurations to your current and future test needs:

Configuration choices include:

  • Operating speed: 25 MHz or 50MHz
  • Voltage range: ±15V or ±30V
  • Channel count: 32, 48 or 64

System Options

Additional Capabilities and Accessories

  • Optional interface adapters and cables
  • Optional extended warranty/advanced replacement service
Defense & Aerospace Home Page

Bi-Series™

Multiple Module Serial Bus Test Instrument

COTS serial bus test instrument provides real-time emulation and test.

The wide variety of serial buses used in defense and aerospace applications typically requires multiple single-purpose instruments. Too often, they are difficult to reconfigure in order to test a different application.

The Bi4-Series provides all the capabilities needed for complete communications bus access test for up to four serial buses used in board level (SRA/SRU) and box level (WRA/LRU) equipment—all in a single VXI module.

The instrument includes test applications, industry-compliant software drivers and hardware enabling straightforward integration into automatic test systems.

With the configuration flexibility needed to effectively test every bus format used in defense and aerospace applications, the Bi4-Series instrument plays a key role in reducing implementation time and test system cost.

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bi series bus test

Advantages

Synthetic Instrument Flexibility.
Test multiple standard and custom bus protocols using a single instrument.

Superior operational test.
Complete emulation as well as bus functional test capability increases UUT fault capture rate.

Emulates up to 4 buses simultaneously in a single VXI slot.
Lower acquisition cost and smaller footprint results in lower system integration cost, as well as lower TPS implementation and maintenance costs.

Straightforward upgrade capability
With its ability to address changing test requirements, the Bi-Series avoids test system obsolescence, resulting in reduced cost of long-term sustainment.

VXI plug&play™ software drivers supports C programming interface.
Reduces TPS development and maintenance costs with the fully supported C- programming interface that makes it easy to create new test models or modify existing ones.

Production-ready test equipment together with long-term Teradyne support.
Eliminating the problem of bus test obsolescence reduces test system logistics and maintenance costs—all supported by Teradyne’s decades of defense and aerospace test equipment expertise.

Applications

The Bi4-Series is the test solution for a wide variety of buses used in defense and aerospace applications.

Provides standard and serial bus protocol emulation and test for buses including:

  • MIL-STD-1553 A/B
  • ARINC 429
  • ARINC 573
  • RS-232
  • RS-422
  • RS-423
  • RS-485

Configurations

Multiple bus test capability

The Bi4-Series instruments are available in 2– and 4-bus modules.

System Options

Additional Capabilities and Accessories

  • MIC bus and CAN bus capability
  • Interface adapters and cables
  • Extended warranty/advanced replacement service

Spectrum HS™

Spectrum HS™

A Functional Test System Optimized for Real-Time Digital Bus Test

Defense and aerospace manufacturers and field repair depots face ever more rigorous demands for real-time test of boards, assemblies, and systems—especially new products in the development pipeline—that conventional testers can’t handle.

Spectrum HS is Teradyne’s fully integrated functional test system. Optimized for real-time test of low latency buses, it’s a high-performance system delivering excellent test coverage of current and future products.

Designed around PXI and LXI instrumentation, The HS system has the performance, flexibility, and completeness needed to meet formidable analog, digital, mixed-signal, and bus test specs.

Teradyne’s powerful hardware is accompanied by robust yet straightforward software tools that speed comprehensive test program set (TPS) development. More than five decades of Teradyne’s functional test experience are built into the Spectrum HS—the long-term answer to increasingly challenging high-speed test requirements.

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Spectrum HS

Advantages

Faster TPS implementation.
Spectrum’s proven PC-based software development suite reduces TPS implementation time and cost while increasing test coverage. Proven PC-based software development tools reduce test implementation time and effort with full QA by Teradyne of ongoing software releases..

A flexible, integrated test system.
Spectrum HS incorporates industry-leading test functionality, switching, software, self-test and calibration capabilities in a single integrated system that includes power distribution and thermal management.

Open architecture eliminates the threat of obsolescence.
Spectrum HS open architecture incorporates industry standards—PXI, LXI,
VXI, GPIB, IVI, Windows, ATML, safety, EMI—together with expandable size and power, providing straightforward modular expansion as test needs evolve.

High-performance bus test.
Spectrum HS is capable of real-time test of complex buses on boards, assemblies and systems—and is built for the increasingly complex, higher-speed digital buses on the horizon.

Benefit from Teradyne’s application experience and global support
Every Spectrum HS comes with Teradyne’s experienced applications expertise backed by a worldwide support and maintenance infrastructure that ensures rapid setup and implementation, as well as available next-day spare parts service.

Teradyne is here for the long run.
The international trailblazer in semiconductor, production, and depot test for more than 5 decades, Teradyne continues to be the leader in integrated functional test systems for defense/aerospace applications.

Applications

Spectrum HS system applications include:

  • High-performance functional test for analog, digital and mixed boards, assemblies, and systems that incorporate high-speed, low latency busses used in products such as avionics, missiles, and vehicles.
  • Real-time bus testing for today’s and tomorrow’s boards, assemblies, and systems.
  • Performs in virtually every test environment including production test, depot repair of new and legacy products, including legacy rehosting.

Configurations

The Spectrum HS system is available in a virtually unlimited array of configurations—from compact to large:

  • Single bay through six bays
  • Single-tier, double-tier and triple-tier interfaces (ICA)
  • 6 KVA to 60 KVA input power

System Options

Spectrum HS features a broad range of options.

Spectrum HS is designed to work with all standard third-party instruments, including:

  • System level self-test
  • Configuration of ICA cables

Software: Available support for third party software in addition to Spectrum HS standard software.

Defense & Aerospace Home Page

Spectrum BT™

Spectrum BT™

Focused Functional Test System

The Spectrum BT is a fully integrated PXI-based test platform optimized for testing a focused group of Unit Under Tests (UUTs). The Spectrum BT provides best-in-class functional test capability and configurability at a size and price that meets the needs of engineering labs, manufacturing facilities, and depots.

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Compact, Cost-Effective Test Solution

  • Compact solution with flexibility and configurability to support a wide range of test applications
  • Standards-based and open architecture provides a vast number of options to meet the most demanding present and future test requirements
  • Compact system fits on a workbench, with an expansion capability via a mobile cart to cover a range of applications
  • Full compatibility with Teradyne’s Spectrum HS allows cost-effective scalability throughout your product life cycle
  • Fully integrated, standard system includes system cooling, self-test, wire verification test, and an extensive documentation package

Typical Test Applications

  • Focused test solution addressing a focused set of UUTs
  • Common and scalable solution for multi-site and outsourced manufacturing
  • Design Verification and system integration testing
  • Troubleshooting faulty products
  • Test Program Set (TPS) development

Configurations

  • The Spectrum BT base system includes:
  • Teradyne OEM PXIe chassis with controller
  • 2U Computer
  • 64-Channel 6020-Series digital instrument
  • Modular power supply
  • System self-test

System Options

Spectrum BT features a full range of useful options as well as numerous PXI/LXI instrument options to meet every test requirement.

Receiver:

  • Full G20 receiver for mass interconnects
  • Full G20X receiver for Spectrum HS compatibility

PXI/PXIe/LXI Test Instruments:

  • Serial, parallel, custom and standard bus instruments
  • Real-time processing and storage instruments for data-intensive testing
  • High-channel count parallel digital instruments
  • Precision Analog instruments
  • Optical test instruments
  • RF instruments and subsystems
  • Standard third-party instruments

Switching:

  • Digital/Optical switching
  • RF switching or customer-specific RFIU
  • Crosspoint matrix
  • High Bandwidth switch modules
  • Switch management software

Other Options:

  • Mobile Cart
  • Additional instrumentation space / Larger PXI chassis
  • Higher power PDUs
  • Work Surface
  • Articulating swing arm for display
Defense & Aerospace Home Page

Spectrum-9100™

Spectrum-9100™

High-Performance Integrated Functional Test Platform

The Spectrum-9100 is a fully integrated functional test system for factory, depot, and intermediate test applications. It’s the “go to” tester for users needing a mix of digital, analog, mixed-signal, and bus test capabilities across a wide range of products—from legacy boards to advanced systems.

An open, standards-based hardware and software architecture consists of fully developed, fully documented building blocks. These deliver the flexibility and scalability needed to speed test program set (TPS) development and simplify maintenance.

The Spectrum-9100 is a cost-effective test solution—the field-proven defense and aerospace standard for high-performance functional test. More than 300 systems are currently in use worldwide in factories and depots, as well as commercial avionics maintenance and repair facilities.

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Spectrum-9100

Advantages

Comprehensive digital, analog, mixed-signal, and bus test capability.
Spectrum-9100 is the choice of defense and aerospace product manufacturers and depots requiring a powerful yet flexible functional test system to verify, and/or diagnose a wide variety of future, current, and legacy products.

The defense and aerospace ATE standard.
Spectrum-9100 is the industry standard whose wide-ranging test capability that eliminates problems associated with UUT compliance and validation tests.

A flexible, integrated test system.
Spectrum-9100 packs industry-leading test functionality, switching, software, self-test and calibration capabilities in a single integrated system that includes power distribution and thermal management.

Open architecture.
Spectrum-9100 open architecture incorporates industry standards—PXI, LXI, VXI, GPIB, IVI, Windows, ATML, safety, EMI—together with expandable size and power, providing straightforward modular expansion as test needs evolve.

Faster TPS implementation.
Spectrum’s proven PC-based software development suite reduces TPS implementation time and cost while increasing test coverage. Proven PC-based software development tools reduce test implementation time and effort with full QA by Teradyne of ongoing software releases.

Benefit from Teradyne’s application experience and global support.
Every Spectrum-9100 comes with Teradyne’s experienced applications expertise backed by a worldwide support and maintenance infrastructure that ensures rapid setup and implementation, as well as available next-day spare parts service.

Applications

Spectrum-9100 systems are at work where defense and aerospace products are tested. Applications include:

  • High-performance functional test for boards, assemblies, and systems used in defense/aerospace products such as avionics, missiles, and vehicles.
  • Applications requiring analog, digital, mixed-signal, and/or bus test including performance digital test, parallel test, real-time bus test.
  • Performs in virtually every test environment including production test, depot repair of new and legacy products, including legacy rehosting.

Configurations

The Spectrum-9100 system is available in a virtually unlimited array of configurations—from compact to large:

  • Single bay through six bays
  • Single-tier, double-tier and triple-tier interfaces (ICA)
  • 10 KVA to 60 KVA input power

System Options

Spectrum-9100 features a full range of options.

  • Analog Instruments
  • Bus Instruments
  • Digital Instruments
  • High Speed Subsystem
    • Serial, parallel, custom and standard bus support
    • Unique three-tier architecture incorporates the advantages of simple field-programmable gate array instruments
    • Real-time interaction with unit under test
    • Fully integrated with other Spectrum-9100 instrumentation
  • Switching
    • Crosspoint matrix optimized for Di-Series and Spectrum Analog Instruments.
    • High Bandwidth switch modules
    • Switch management software
  • Third-Party Instruments
    • Spectrum-9100 is designed to work with all standard third-party instruments, including:
      • System level self-test
      • Configuration of ICA cables
    • Software: Available support for third party software in addition to Spectrum-9100 standard software.
Defense & Aerospace Home Page

Saturn

Saturn

High-Density Disk Drive Test System

The Teradyne Saturn™ HD is the industry leader in 3.5” Near-Line Hard Disk Drive (HDD) testing. It provides maximum throughput while minimizing factory floor space and power consumption. The system is designed to perform single insertion of SSW, BDSW and Burn-In as well as drive configuration. Using Saturn HD on the production floor will reduce drive build times, enable greater responsiveness to data center demands and lower test costs per HDD unit.

Offering the highest slot density per m2 in the industry, the Saturn HD can scale the number of test slots from approximately 4,000 to over 24,000 slots per system. Manufacturers using Saturn HD reduce the required factory floor space by 66% or more, versus a manual tester.

Teradyne’s automated HDD test solution provides optimized vibe control to test SSW and BDSW. This is a key feature to enable single insertion testing with burn-in and drive configuration. The system eliminates operator touch points, Work-in-Progress (WIP) and excess material on the test floor ensuring a very efficient test process. The end result is the highest throughput per m2 of floor space.

Power consumption is an important element of test costs. One of the biggest power consumers in back-end test is drive thermal control. The Saturn HD uses conductive heating strips for performing hot temperature tests that directly contact the drive rather than inefficiently having to warm air to raise disk drive temperatures. Within the tester, a unique closed loop cooling system is used to reduce the disk drive temperature to ambient for continued testing. This thermal control approach results in the lowest power consumption per drive slot in the industry.

In addition, the Saturn HD offers a beneficial capability for testing individual drive models in each slot due to the asynchronous operating architecture of the system. This provides manufacturers with product mix flexibility while maintaining peak throughput.

Advantages

Highest test slot density per m2 of the factory floor (3x over manual testers) – eliminates the need for multiple new factories

Highest through put per m2 of the factory floor

Efficient test process eliminates operator touch points and reduces drive lead time and WIP via ability to support single insertion of multiple test steps, including SSW and BDSW

Reduces power consumption per HDD tested

Per DUT thermal control and data collection

Asynchronous test slots can run individual drive models in each slot for total flexibility and optimized throughput

Applications

  • Back-End high volume manufacturing test for 3.5” HDDs in a single insertion
  • Tests helium-filled and air-filled drives used in Data Centers and Hyperscalers around the world
  • Supports both Windows and Linux operating systems
  • Executes customized test scripts via the system Applications Programming Interface (API)
  • Provides serial data System Management (SM) Bus or Universal Asynchronous Receiver Transmitter (UART) interfaces
  • Multi-temperature testing from ambient to +85°C
  • SSW and BDSW test capability in a single insertion
  • Extendable to interface with factory automation
  • Customizable data collection

Configurations

  • Can support both WIN and Linux
  • Run customer test scripts via system API
  • Serial data (SM Bus or UART) interface
  • Ambient to +85C test range
  • Vibe control for sensitive SSW and BDSW tests
  • Power per slot to per slot drive power control
  • Factory Automation friendly

System Options

Based on customer applications, need to contact sales for information

UltraFLEX

UltraFLEX

Test System Optimized for High-Performance Digital and SoC

Delivering superior economics and fast time to market with the industry’s highest rated software, the UltraFLEX test system has the power and precision you need for complex SoC devices. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count.

Advantages

Superior Flexibility, Throughput & Scalability

The UltraFLEX scales from low pin count, analog-dominant devices to massive parallel test of high-end processors with superior parallel.

Maximum Test Quality and Yield

The UltraFLEX’s performance allows integrated circuit producers to meet the conflicting goals of “zero” defect rates and maximum device.

Faster Time to Production

Teradyne’s IG-XL software speeds time to market and reduces cost of test by transforming test program development.

Applications

  • Mobile Application Processor
  • Digital Baseband Processors
  • High Data Rate RF Transceivers
  • RF Connectivity Devices
  • mmWave
  • 5G
  • Mobile Power Management ICs (PMIC)
  • Microprocessors
  • Network Processors
  • High Speed SERDES (SERializer/DESerializer) and Backplane Transceivers
  • Storage Controllers
  • High-end Microcontrollers
  • Audio and Video Processors

Configurations

The two available UltraFLEX base systems allow customers to optimize capital cost and floor space, and maximize resource count. All three versions will accept the same device interface boards (DIBs) for application portability and use exactly the same instrument options for the most effective capital reuse and production flexibility. All heads feature a universal slot architecture, which allows any instrument to be installed in any slot.

The UltraFLEX test heads utilize SureMate® connections to the DIB which provide easy system reconfiguration and optimum instrument performance at the applications interface. Liquid cooling of high-density instrumentation also guarantees consistent hardware performance and increased reliability.

UltraFLEX-HD
12-slot system

UltraFLEX-SC
24-slot system

System Options

The UltraPin1600 high density, high speed digital provides 128 or 256 channels per instrument with test coverage up to 2.2Gbps. The UltraPin1600 implements Teradyne’s ground-breaking multicore, hardware-based Protocol Aware capability that allows individual pin groups to be saved to device data rate and timing and eliminates the need for digital patterns for programming standard data busses.

Proprietary hardware for same-cycle source synchronous capability and “walking strobe” timing measurements provides production test capability for high speed DDR and other critical applications when needed. The UltraPin1600 is also test program compatible with the earlier UltraPin800 and HSD1000 digital options.

The UltraPAC80 high density AC source and capture instrument offers up to 8 source and capture channels, each with dedicated audio and video analog paths. Teradyne’s proprietary sample clock architecture provides the user with complete sample frequency flexibility without performance compromise and guaranteed phase alignment to every other instrument on every run of the test program to eliminate the need for job-specific calibration to achieve the phase balance required for the highest performance RF transceivers.

The UltraVI80 high pin count, high accuracy voltage and current option provides 80 independent pins of “3-in-1” capability.  Each UVI80 pin is a true voltage or current (VI) source and measure instrument complete with ultra high-accuracy differential voltmeters and time measurement units available to each pin for complete, massively paralleled testing of mobile power management devices. In addition, UVI80 channels can operate in a special, low-droop voltage source mode that offers unmatched power supply noise performance for sensitive analog and RF applications. Finally, each UVI80 channel has an embedded high performance AC waveform source and measure capability for highly paralleled test of D/A and A/D converters embedded in complex SOC or microcontroller devices.

The UltraVS256 high density Device Power Supply (DPS) provides 256 independent channels per instrument to provide the massively paralleled capability required by low power mobile communications devices. The UVS256 also offers a clamp-based current source capability for device parametric testing.  The UVS256 provides test engineers with the capability of programmable output bandwidth and full pattern setup and measure control that results in reduced DIB complexity and faster test times.

The HEXVS and VSM Ultra High Accuracy and Stability Processor Core Supplies improve performance and yield of complex processors by offering unmatched voltage accuracy and stability under load. This allows devices to be configured for maximum performance at lower voltages, increasing the value and yield of devices tested on UltraFLEX.

The DC30 and DC75 voltage/current supplies extend DC capability to 30 volts and 75 volts to address high voltage test requirements of of mobile power management and other devices. Like the UltraVI80, both options contain a precision differential voltmeter and time measurement capability.

The UltraSerial10G is a high-speed serial instrument that can test expanding serial bus technologies and replicates the device operating environment for optimal test quality at device limited test time with the highest possible throughput. This instrument has 20 differential drive and receive ports (40 channels/80 wires) per board, a frequency range of 42Mbps to 10.7Gbps with 426M drive/compare, and 1Gig capture memory, and includes pseudo-random bit stream (PRBS) hardware, and protocol aware testing support for PCIe. All of these features are designed to provide an efficient test methodology for SerDes bus testing.

Wireless Test

UltraWaveLX

The UltraWaveLX subsystem, available in multiple configurations, delivers emerging wireless protocol capabilities by seamlessly integrating LitePoint’s leading edge technologies within the UltraFLEX platform.

The UltraWaveLX-RF delivers 802.11be (Wi-Fi 7) testing capabilities, while the UltraWaveLX-UWB serves UWB testing conditions, and the UltraWaveLX-60G supports mmWave applications in the 60 GHz band. These configurations can be combined to deliver multiple cutting-edge RF test capabilities within a single test platform.

UltraWave24

The UltraWave24 high port count RF options provide up to 96 universal, vector RF ports with carrier frequencies and modulation bandwidths to cover the most advanced cellular and connectivity standards. The UltraWave options offer accuracy and phase noise performance equal to or better than the highest performance bench equipment available, and integrate waveform sourcing and capturing onboard to eliminate the need for additional tester instruments. The UltraFLEX ESA software toolkit and UltraDSP1 option provide industry-standard modulation and demodulation tools running on up to 32 dedicated processing cores with automatic data download via a dedicated high-speed data bus for simple correlation to industry standards and the highest possible throughput.

Teradyne is the leader in RF/wireless device testing and has a large installed base of UltraFLEX test systems with the UltraWave24 RF instrument. As new devices for handset and base station applications are introduced using mmWave technology, Teradyne’s mmWave instrumentation has expanded in anticipation of testing demands.

UltraWaveMX

The UltraWaveMX53, UltraWaveMX44, UltraWaveMX20-D16 and UltraWaveMX8 are Teradyne’s MX family of instruments for mmWave frequencies. These instruments extend the UltraWave24 capability for full test coverage of WiFi, LTE, Ultra-wideband and 5G standards for frequencies below 52.6 GHz. Existing UltraWave24 customers can upgrade their systems with a single slot instrument that does not require reconfiguration of the test system. They can continue to use existing device interface boards (DIBs) and production interface docking compatibility for their existing applications.

The MX family of instruments targets RF and IF interfaces for both 5G IF transceiver and 5G RF beamformer device coverage. And they support characterization and production device testing for probe, package, module and over-the-air applications.

A patented active thermal control within the instrument guarantees temperature stability to ensure that high-performance specifications are met in the engineering and production environments. The UltraWaveMX instruments also feature integrated power detectors which provide specification traceability. There is a dedicated low phase noise DUT reference clock operating from 100 MHz to 6 GHz to supply a precision reference clock for devices with integrated PLLs.

These instruments feature native 5G-NR modulation and demodulation test coverage with the integrated ESA toolkit using industry-standard waveform algorithms for waveform modulation and demodulation to simplify bench-to-ATE correlation.

The instruments provide dedicated mmWave frequency blind-mate coaxial DIB connections, which are designed to withstand the challenges of a production environment while providing the performance to source and measure high quality from 8 GHz to 53 GHz test waveforms to the device.

The award-winning IG-XL test software environment enables simple programming for fast test program development. Interactive debug displays integrated with the instrument hardware create an intuitive software system that minimizes training and speeds time to market.

The UltraWaveMX53 addresses the need to cover the 5G FR2 frequencies up to 52.6 GHz. The instrument provides unmatched performance over the full frequency range with fully integrated temperature stabilization and calibration features. The integrated synthesizer per channel architecture provides best-in-class phase noise performance that enables source and measure capabilities of modulated waveforms with unprecedent EVM performance.

The UltraWaveMX53 instrument is available in three configurations: -D16, -IF and -RF. Each of these configurations provide two channels and 16 ports that cover up to 53 GHz. The IF and RF configurations add two more channels with a total of 16 additional ports that cover up to 20 GHz and 44 GHz respectively.

Teradyne’s UltraWaveMX44 provides coverage from 24 GHz to 44 GHz.  The available 32 mmWave ports on the UltraWaveMX44 significantly simplify DIB design. For greater site density, the system can scale to up to 128 mmWave ports, which is necessary for multisite testing that delivers the lowest cost of test.

The UltraWaveMX20-D16 is Teradyne’s lower frequency band instrument. It is also an extension to the UltraWave24 to provide additional test coverage up to 20 GHz. This frequency band targets devices that have WiFi-6, Cellular 5G, Ultra-wideband, and 5G-NR IF interfaces. Each UltraWaveMX20-D16 provides 16 mmWave ports in the test system with the ability to scale to 64 mmWave ports for high site count testing.

The UltraWaveMX8 adds mid-band RF test capabilities to support WiFi-6E & 5G test needs. Adding the MX8 as a 1-slot upgrade to any UltraFLEX system with UltraWave24 extends the frequency range to 7.5GHz. Up to 160 MHz of bandwidth is available for supporting 802.11 modulated tests, and 16 RF ports with 8 channels are provided for high parallelism and efficiency. The MX8 provides industry-leading WiFi-6E test capabilities with faster time to market, higher yields, and lower costs.

By utilizing Teradyne’s UltraWave instruments, semiconductor manufacturers can configure their test systems with the most cost-effective solution to test current and future generations of mmWave devices, enables faster time to market and higher product yields. The MX44, MX20, and MX8 extend the UltraWave24 capability for full test coverage of IoT, WiFi, LTE, Ultra Wideband, and 5G standards while maintaining full DIB and docking compatibility.

As the leading provider of complete Test Cell Solutions and services, we at Teradyne leverage our expertise, experience, and technology leadership to help our customers achieve the highest yield and the highest throughput in production with the fastest time to market. We partner with you in your journey from design to production to provide standard and customized test cell products and services.

Optical Switching & Power Management

VERTA™

Integrated solution for digital switching and fiber optics operational verification

VERTA is an integrated instrument that combines inline optical power management for optical parametric tests, together with a high-speed, digital switch matrix for concurrent optical and/or copper interconnections between multiple bus test instruments and UUT interfaces. VERTA enables reliable, error-free bus communication and interoperability for high-speed, optically networked military weapon assemblies to minimize costly intermittent and No Fault Found test results.

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Download VERTA PXIe Datasheet

Configurations

VERTA is available in two configurations: an integrated LXI instrument and a PXIe 2-slot instrument.

The LXI configuration should be selected for test applications requiring 8 to  80 optical UUT I/O connections. It consists of a foundation chassis with modular I/O modules:

  • Multi-Protocol Switch Module (Verta-3010) supports numerous SFP transceivers with optical or copper connections, multiple or single mode fiber that supports multiple bus protocols from 100M to 10G.
  • Optical Power and Switch Module (Verta-3020) Adjustable power and repeatable measurement to detect faults across network operating range and compensate for ATE path loss.
  • Wide-Range Power Module (Verta-5010) for optical-to-optical testing featuring extended range power attenuation across the network operating range

The PXIe configuration (Verta-P3020) is ideal for up to 4 optical I/O connections of switching and optical power management and can be installed in the same PXIe chassis as the bus test instrumentation it connects with. The PXIe VERTA provides a compact and scalable solution and can be expanded to up to 12 connections by bussing together instruments.

LXI Foundation Options

Rear maintenance Verta Foundations

  • Verta-1004 (10 Gbps max., 4-slot)
  • Verta-1007 (10 Gbps max.7-slot)

Front Maintenance Verta Foundations

  • Verta-404 (4 Gbps, 4-slot)

Capabilities and Applications

VERTA Capabilities

  • High-speed digital switching of optical or copper connections that supports multiple bus protocols over 100Mb/s to 10Gb/s
  • In-line parametric test of optical transmitters and receivers to confirm operational requirements at factory test and depots, thus ensuring the interoperability of assemblies in network.
  • Concurrent test of multiple buses on a single UUT, and parallel test of multiple UUTs.

Test Applications

  • Next generation MOSA-compliant weapon systems with fiber optic connections and VITA 64 bus protocols such as Ethernet, Serial FPDP, and Fibre Channel.
  • Newer weapon systems such as F-35, B-21, NGAD that use a fiber optic backbone to interconnect a distributed arrays of radar, video, sensors, data storage, displays, and processing units.
  • Weapon system modernization upgrade platforms such as the F/A-18E/F, F-15 EX with fiber optic technology

Advantages

  • A wide range of supported buses and speeds (in both optical and copper) provides flexibility to replace most existing high-speed switches and eliminates redundant copies of test instruments
  • Optical parametric test improves operational readiness of Weapon Systems, reduces number of bad assemblies in repair pipeline which in turn reduces overall UUT support costs
  • Fully integrated solution reduces footprint and lowers acquisition cost as well as TPS implementation and maintenance cost
  • Teradyne’s long-term support ensures long product life cycle and low ATE maintenance cost
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Bus Test

High-Speed Digital Bus
Test Instruments

Teradyne and AIT instruments test legacy and newer digital buses.

The enormous variety of digital buses used in defense and aerospace applications requires comprehensive, yet efficient testing.

Teradyne and AIT COTS instruments meet these challenging bus test requirements for legacy and standardized buses, as well as evolving digital buses that have faster speeds, larger data volumes, and increasingly complex protocols requiring real-time test and emulation.

HSSub™ Instrumentation

HSSub PXI Express instrumentation and HSSub Apps are a family of high performance, reconfigurable, multi-purpose bus test solutions for concurrent asynchronous UUT digital bus interfaces that address rapidly evolving test requirements. They significantly reduce the long-term logistics costs caused by inflexible configurations and multiple point-solution bus test instruments.

HSSub Instrument Options

Bi4-Series Bus Test Instrument

The VXI Bi4-Series bus test instruments are a versatile COTS solution providing real-time serial bus test and emulation, including test applications for a wide range of existing serial bus protocols.

Bi-Series

AIT Test Instrumentation

AIT features a broad range of standard bus interface and test modules available in a wide variety of packages and software programming environments.

Avioncis Interface Technologies Instruments

Advantages

Reduce cost of long-term sustainment.
Choose from a wide range of bus test and emulation instruments and software that precisely match current and anticipated test requirements with ongoing support from the leaders in defense and aerospace test equipment.

High density form factors: VXI, PXI, PCI.
Compact, high density instruments reduce system footprint and reduce overall cost.

Lower cost of ownership and equipped for future test capability.
As bus specs continue to evolve in speed, data volume, and complexity, a wide range of instrumentation from a reliable and experienced supplier avoids single-purpose bus test instruments or too-basic configurable instruments that complicate system integration, documentation, and lengthen TPS development times.

Defense & Aerospace Home Page

Digital Test

Digital Test Instruments

High-performance VXI and PXI instruments for digital functional test.

Teradyne’s Di-Series and eDigital-Series digital test instruments address technologies such as low voltage differential signaling (LVDS), while maintaining full capability to support  legacy test requirements. In addition to excellent reliability, these instruments reduce test system footprint, programming and support effort, and overall cost-of-ownership.

The Di-Series is a highly integrated, standards-based VXI instrument—a powerful combination of performance and flexibility for testing UUTs with speeds up to 50 MHz.

Using a compact PXIe form factor, the eDigital-Series offers a variety of digital instruments which meet a wide range of application requirements.  The newest instrument in the series offers up to 544 channels of synchronized parallel digital test with per-pin voltage levels and timing combined with user programmable FPGA for reconfigurability resulting in the most versatile flexible digital instrument in the industry.

Advantages

Superior performance.
Flexible parallel functional test for a wide range of technologies, including TTL, LVTTL, and LVDS that improves test quality and decreases No Fault Found escapes.

High density form factors.
Both VXI and PXIe form factors increase channel density while reducing overall test system footprint.

Reliability and survivability.
High-density packaging and strict quality control including shock and vibration testing ensure low mean time between failure (MTBF) in the most rugged shipboard and mobile environments.

Worldwide support.
Available support services include 24-hour repair-and-return of defective parts, hotline telephone support, comprehensive training and documentation, and in-field calibration verification.

Applications

High performance digital instruments for ATE and discrete test systems.

Integrate Teradyne digital test instruments into new and existing ATE systems requiring high performance and/or multiple channel functionality in high density, compact packages.

Replace older, slower discrete (rack mount) instrumentation with high-density, advanced digital capability available at every test channel.

Configurations

Choose the instrument family that will meet your current and future test needs. Both instruments may be integrated into new or existing ATE systems.

Di-Series:

  • VXI form factor
  • Up to 50MHz
  • Voltage range: ±15V or ±30V
  • Channel count: 32, 48 or 64

eDigital-Series:  

  • PXIe form factor
  • Up to 25MHZ
  • 3V, 2.5V, 1.8V, LVDS levels (5V Tolerant)
  • Channel count: 32 dynamic and 32 static channels, or 32 differential channels
Defense & Aerospace Home Page

Analog Test

Analog Test Instruments

Analog test building blocks for high performance ATE.

Teradyne offers two families of analog test instruments

  • VXI-based Core System Instruments (CSi)
  • ZT-Series™ PXI/LXI instruments.

Both families meet today’s demanding test requirements as well as bringing improved test capability to legacy ATE systems.

Older analog instruments found in production and depot test systems used in defense and aerospace applications often result in slow throughput, inadequate test coverage, and spotty fault diagnosis of Line Replaceable Units (LRU)—especially newer units with more stringent performance specs.

Teradyne offers two families of analog test instruments

  • VXI-based Core System Instruments (CSi)
  • ZT-Series PXI/LXI instruments.

Both families meet today’s demanding test requirements as well as bringing improved test capability to legacy ATE systems.

CSi family instruments include Digital Sampling Oscilloscope (DSO), DMM, and Multi-Function Analog (MFA) capabilities that are ideal for both new and existing ATE systems. Several CSi instruments feature multi-channel parallel synchronized capabilities that speed test throughput.

The compact PXI- or LXI-based ZT-Series DSO and Arbitrary Waveform Generator (AWFG) instruments are perfect for new ATE systems requiring a smaller footprint.

Ai-710

VXI analog test instrument with advanced parallel test capability speeds test throughput.

Ai-762

Standards-based VXI test instrument combines legacy functionality with advanced parallel test capability.

ZT-Series

High-Performance Digital Storage Scopes, Digitizers, Waveform Generators. Modular test instruments for straightforward integration into test systems.

Advantages

Tester-per-pin architecture available on several CSi instruments.
Simplifies Interface Test Adapter design by combining full stimulus/ measurement capability on every CSi analog channel.

Superior test performance across a wide range of specifications.
Both families provide high throughput tests and parallel stimulus/measurement of complex systems such as mixed signal Line Replaceable Units (LRU).

High functional density form factors.
Both VXI and PXIe form factors increase channel density while reducing overall test system footprint—and cost.

COTS architecture.
Delivers stimulus and measurement flexibility and high reliability together with lower acquisition cost, resulting in lower life cycle cost.

Worldwide support.
Available support services include 24-hour repair-and-return of defective parts, hotline telephone support and comprehensive training and documentation.

Applications

High performance analog instruments for ATE and legacy test systems.

The optimum test and measurement solution for new mixed signal ATE systems that require high performance and/or multiple channel stimulus measurement functionality in high density, compact packages.

Replace older, slower discrete (rack mount) test and measurement instruments with high-density, advanced analog capability available at every test channel.

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TPS Converter Studio

TPS Converter Studio

Test Program Rehost Solution for L-Series™ to Spectrum-9100™ & Di-Series Migration

Teradyne’s TPS Converter Studio preserves L-Series test program set (TPS) investments by enabling conversion of analog and digital test programs and diagnostics to run on modern test systems. Complete with fault dictionary and guided probe diagnostics, TPS Converter Studio translates legacy L-Series code to C/C++ DLL, EXE files or digital test binary (DTB) format. Converted code can be run on the Spectrum 9100-Series systems or the Di-Series and M9-Series digital test instruments.

Before conversion, TPS Converter Studio’s screen capability allows users to identify and correct configuration and test program issues. The software flags architectural or syntactic inconsistencies between the L-Series source files and the target environment and offers recommendations for solving them.

TPS Converter Studio provides an engine to query the reports generated during the screening process, enabling users to mine TPS contents and quickly perform analysis across multiple test program sets. The converted code can take advantage of the new Teradyne Digital Runtime environment to provide interactive debug capabilities for digital instruments.

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TPS Converter Studio

TestStudio™ Software

TestStudio™ Software

Teradyne’s TestStudio is an open-architecture, web-based software that manages test program set (TPS) development, documentation, debug and execution—ensuring fast, efficient TPS development and support. TestStudio leverages common Microsoft Windows application development environments (ADEs) and COM interface standards to ensure easy integration with in-house programming tools. TestStudio also supports the use of major ADEs such as C#, C++, LabWindows, CVI and Labview.

With TestStudio, TPS developers can capture test program documentation in real time—online in HTML or any format viewable by Internet Explorer, including Microsoft Word, PowerPoint and Excel. This eliminates the need to reformat data for exchange across user networks or applications. TestStudio’s versatility enables advanced test sequencing, giving TPS developers the flexibility to reorder test steps and reuse existing test code from various sources. Plus, TestStudio’s single, intuitive user interface reduces the cost of training, documentation and ongoing maintenance.

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test studio

LASAR™ Software

LASAR™ Software

Teradyne’s LASAR™ simulation software is the U.S. defense industry’s standard for digital test program set (TPS) development. LASAR focuses on the problems facing the test engineer by predicting the timing variability of signals and the behavior of the unit under test (UUT) when a physical or logic fault is present. LASAR then builds an accurate diagnostic database for isolating faults on the UUT. LASAR also reduces TPS costs by predicting: the effect of the test fixture on the board under test, worst case timing problems and compatibility with the target tester.

The software’s menu-guided programming streamlines TPS development from model creation through fault simulation. Plus, “good” circuit response patterns, fault dictionary and guided probe diagnostic data are automatically generated.

LASAR test patterns and diagnostics results are post-processed to IEEE 1445 (Digital Test Interchange Format) format, and are exported directly to the Teradyne Di-Series and M9-Series digital test instruments.

LASAR can be seamlessly integrated within Teradyne’s TestStudio environment.

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lasar

ETS-364

ETS-364

Test System Optimized for High Volume Production Testing of Integrated Circuits

eagle test systems ETS-364

The ETS-364 is a general-purpose precision analog and mixed-signal test platform designed for high volume production testing of integrated circuits; optimized for high throughput applications with a fully integrated multisite software and hardware architecture.

Advantages

Enabled by patented SmartPin® Technology, and floating architecture, the ETS-364 provides pattern-based test capabilities limited only by the speed of your latest semiconductor products, offering users superior parallel test capability.

Offers excellent economics and delivers broad device coverage and a large potential customer base for OSATs.

ETS-364 gives users the unprecedented ability to scale their test platform within the ETS Test Family to match their throughput demands.

Applications

  • Power Management
  • Battery management devices
  • Consumer audio
  • LED drivers
  • Data converters
  • Temperature sensors, fan speed controllers, smoke detectors
  • Disk drive, sense amps and servo controllers
  • Automotive devices
  • BUSS devices
  • Amplifiers (high precision, high speed)
  • Precision voltage references

Configurations

The innovative EV programming environment optimizes programming efficiency and instrument flexibility to support single site, multisite and bridged applications, all from a common platform.

The ETS-364 system can support:

  • Up to 240 analog channels
  • Up to 128 digital channels

Instrument Options

Platform scalability is key in the semiconductor test market, and ETS-364 system uses the same floating analog resources as the ETS-88 product family.

8×8 MATRIX: high voltage force / sense crosspoint matrix; any input channel can be connected to any output channel

CAMII: instrument module designed to measure capacitance in the sub picofarad range

HCMFB: 16 separate 1×4 solid-state force / sense matrices programmed with a single software command

QHSU: two fully independent dual channel high-speed signal analyzers capable of source or measure up to 50 MHz

WCU-2220: waveform capture instrument with full scale sensitivity from 0.2V to 2000V at 8-bit resolution with a decade of programmable offset available per range

QTMU: 4+ direct input time measurement units multiplexed to digital pins with a start/stop and arm signal per sequencer. Capable of voltage swings up to +/- 50V.

11×16 MATRIX: medium voltage force / sense crosspoint matrix; any input channel can be connected to any output channel with a single software command

DPU-16: 16 digital I/O channels supporting vector rates up to 132 MHz with 8M of standard vector memory

HPU-100: single channel V/I with 10 current ranges operating up to +/-100 A

QMS / QMS-T: four precision (12-bit at 10 Msps or 16-bit at 200 ksps) independent floating differential volt meters that support AC and DC measurements up to +/-200 V

SPEC Cage: test head expansion, relocating high power instruments to the mainframe cabinet

APU-12: 12 channel, four quadrant V/I with six current ranges ranging from 200 mA to 10 uA at +/-30 V

MPU-120: four quadrants V/I with built in 16-bit digitizer capable of forcing voltage up to 120 V and current force up to 40 Amps

QPLU: low noise, analog source and measure resource with 1 PPM (20 bit) accuracy with 381nV resolution

SPU Family (112, 500): a suite of V/I’s capable of addressing a wide range of test requirements ranging from 100V / 2A to 500V / 50mA with fully AWG and digitizing capabilities per channel. SPU-112 is capable of up to 12A pulses when paired with the booster board.

PAM: Pico Amp Module, suitable for sub nA and pA current measurement

Software

The EV software suite is a robust test development environment, elevating applications program development and debug to new heights. Every ETS test system is controlled via PC, running a standard Microsoft® operating system and using Microsoft® .NET C/C++ development tools for code creation. ETS’s software tools are easy to learn, easy to use and are fully integrated into the Microsoft® Visual Studio® development environment.

A suite of automatic code generation tools supports the complete test system command set, providing users with the program control they need without forcing them to memorize coding syntax. Wizard tools are available for creating tests, editing test limits, and changing the test execution flow. Graphical plotting tools are provided for simple point-and-click plotting of test-oriented waveforms. The eRAIDE debug environment makes it easy to view and change tester hardware settings. A robust help file system navigates users through the tool set and provides coding examples, further reducing development time.

As the leading provider of complete Test Cell Solutions and services, we at Teradyne leverage our expertise, experience, and technology leadership to help our customers achieve the highest yield and the highest throughput in production with the fastest time to market. We partner with you in your journey from design to production to provide standard and customized test cell products and services.

Magnum EPIC

Magnum EPIC

Ultra-high Performance Solution for Memory Device Test

Teradyne’s Magnum EPIC is a high-performance test solution for latest generation DRAM devices. These devices are key enablers for technologies like 5G, AI, cloud computing, autonomous vehicles, AR/VR and applications with high definition graphics.

DRAM devices like LPDDR5, DDR5, LPDDR4x and Graphics DDR are produced in large volume and require high parallel test efficiency.  The current and future generations of high-speed DRAM devices also require excellent signal integrity performance from the test solution.

Testing Next-Generation Memory Devices

Let us use 5G as an example, the next-generation 5G mobile network promises improvements on throughput and latency many orders higher than 4G. 5G will enable amazing possibilities for multimedia and VR/AR applications. To achieve these possibilities, mobile devices would need advanced DRAM solutions to keep up with the speed requirements.

A traditional memory tester architecture has limitation for distributing high-speed signals to the Device under Test (DUT). It uses long cables between the Signal Instrument (Pin Electronics) and the Device Specific Adapter (DSA) or Loadboard for signal delivery. This approach degrades the quality of signal delivered to the DUT due to signal attenuation.

Near DUT Test Technology

So, how does the Magnum EPIC improve signal integrity performance for high data rates, which new DRAM devices require?

Magnum EPIC utilizes revolutionary Near DUT Test (NDT) technology where the Signal Instrument (Pin Electronics) interfaces directly with the DSA, thereby eliminating the long traditional cables used for signal delivery. As a result, Teradyne’s innovative NDT technology delivers the best signal integrity performance at the highest data rate. In addition, NDT technology results in a much shorter Round Trip Delay (RTD) time, which decreases test time for Read Modify Write (RMW) patterns.

Magnum EPIC also supports advanced features like source sync required for testing latest DRAM devices. Source sync increases the eye size of the DUT output DQ signals, thereby enabling higher yields and improving margins.

Configurations

Magnum EPIC SSV

Teradyne’s Magnum EPIC SSV is configurable production test system for final test applications. With over 18.4K high-speed digital channels (at 7Gbps per channel) and 2K device power supply channels, the test system maximizes parallel test capacity needed for high-volume DRAM devices. The system can be configured with up to 128 Memory Test Units (MTUs) which contains a pattern generator and 144 high-speed digital pins.

Magnum EPIC EV

Magnum EPIC EV is a self-contained engineering test system for test program development and debug. It is configurable with up to 1,152 high-speed digital pins (at 7Gbps per channel). Test programs and the Device Specific Adapter (DSA) are fully compatible with the Magnum EPIC SSV production system.

For each tester configuration, it is easy to upgrade while maintaining DSA and test program compatibility.

Production and Characterization Testing of High-Speed DRAM Devices

Magnum EPIC leverages the industry standard Magnum suite of ATE software. Its ease of use greatly helps in test program development, debug and smooth transition from bring-up to production phase.

In addition, the Magnum EPIC supports concurrent testing of Multi Chip Package (MCP) devices (LPDDR and NAND in one package); thereby further increasing parallel test efficiency.

Magnum VUx

Magnum VUx for NAND Protocol Test Enhancement

Ultra-High Performance NAND Protocol Test Enhancement to Magnum V Platform

Teradyne’s Magnum VUx system is a flexible, superset test platform for all NAND and MCP products, both cutting edge UFS 3.0, uMCP, and PCIe Gen 4 mobile and automotive devices, as well as SSD NAND ONFI and Toggle, and legacy NAND products such as UFS 2.1, PCIe Gen 3, e.MMC, and eMCP.

Protocol NAND

Advantages

Flexible

Magnum VU is a flexible, superset test platform that uniquely covers all NAND test, not only protocol test of next generation mobile and automotive devices UFS3.0 and PCIe Gen 4, but also the previous generation of mobile devices UFS2.1, PCI Gen 3, even e.MMC, as well as ONFI, Toggle, and raw NAND for the SSD [Solid State Drive]. This flexibility provides the lowest risk investment for all next generation NAND test capacity and engineering.

Scalable

Magnum VU is a long lifetime, scalable test platform. In order to leverage customer’s investments in our test platform, Teradyne designed the Universal Protocol Board to be easily upgradable, originally UPB, this year UPBx, then when the next technology comes UPBy.

Highest Performance and Highest Throughput

Magnum VU is the highest performance, highest throughput test platform. Using Teradyne technology to miniaturize the UPB instrument, Teradyne radically changed the test paradigm, completely eliminating the traditional cabling between the test instrument and device under test [DUT], and directly docking the UPBx to the socket boards. This architecture, called Near DUT Test [NDT], dramatically shortens the signal path, increases performance, reduces latency, and most closely emulates the real system environment.

Applications

  • UFS3.0 & UFS2.1
  • NVMe and custom protocols
  • PCIe Gen3 and Gen4
  • eMMC
  • Toggle NAND
  • Legacy NAND
  • ONFI FLASH
  • MCP
  • eMCP
  • uMCP

Configurations

Magnum VU EV

  • Self-contained, engineering test system for test program development and device debug
  • Configurable up to 16 UPBx to test 64 UFS3.0 or PCIe Gen 4 devices (1-2 lanes)
  • 100% compatible electronics, software, DSAs, cal and diags with Magnum VU SSV and GV production systems

Magnum VU SSV

  • For high volume, production final test applications
  • Configurable up to 128 UPBx to test 512 UFS3.0 or PCIe Gen 4 devices (1-2 lanes)
  • Integrated with Teradyne Vertical Plane Manipulator for efficient docking to industry standard device handlers

Magnum VU GV

  • For highest volume, production final test applications
  • Configurable up to 192 UPBx to test 768 UFS3.0 or PCIe Gen 4 devices (1-2 lanes)
  • Integrated with Teradyne Vertical Plane Manipulator for efficient docking to industry standard device handlers