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What Makes Teradyne a Leader

Teradyne ensures your devices work right the first time – so you can get your products to market and into the hands of customers, fast.

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Teradyne Connects and Tests It All

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MARKET REPORT

The Automation Economy: Human and Machine Collaboration

What’s the real story? Go beyond the headlines and shift your mindset about robots and jobs.

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Teradyne Connects and Tests It All

Teradyne solutions span the development process. From concept to shipping product, we have the automation you need.

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VIDEO

Teradyne Connects and Tests It All

Teradyne solutions span the development process. From concept to shipping product, we have the automation you need.

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VIDEO

What Makes Teradyne a Leader

Teradyne ensures your devices work right the first time – so you can get your products to market and into the hands of customers, fast.

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VIDEO

What Makes Teradyne a Leader

Teradyne ensures your devices work right the first time – so you can get your products to market and into the hands of customers, fast.

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Teradyne Connects and Tests It All

Teradyne solutions span the development process. From concept to shipping product, we have the automation you need.

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Let’s Push the Limits of Test

The Production Board Test line-up is better than ever, now available with our new TestStation Development Pro 8.0 Software.

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VIDEO

What Makes Teradyne a Leader

Teradyne ensures your devices work right the first time – so you can get your products to market and into the hands of customers, fast.

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VIDEO

What Makes Teradyne a Leader

Teradyne ensures your devices work right the first time – so you can get your products to market and into the hands of customers, fast.

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VIDEO

Teradyne Connects and Tests It All

Teradyne solutions span the development process. From concept to shipping product, we have the automation you need.

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VIDEO

Teradyne Connects and Tests It All

Teradyne solutions span the development process. From concept to shipping product, we have the automation you need.

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What Makes Teradyne a Leader in Test

Teradyne ensures your devices work right the first time – so you can get your products to market and into the hands of customers, fast.

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VIDEO

What Makes Teradyne a Leader

Teradyne ensures your devices work right the first time – so you can get your products to market and into the hands of customers, fast.

Watch Now

VIDEO

Teradyne Connects and Tests It All

Teradyne solutions span the development process. From concept to shipping product, we have the automation you need.

Watch Now

VIDEO

What Makes Teradyne a Leader in Test

Teradyne ensures your devices work right the first time – so you can get your products to market and into the hands of customers, fast.

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Reconfigurable Instruments & Subsystems

High Speed Subsystem

Software-defined, Reconfigurable Solutions for High-Speed Digital Test Applications

HSSub is a software-defined family of PXIe Instrumentation that can be integrated and scaled to support digital test applications throughout the product life cycle from design verification to production and sustainment.

HSSub instruments are configured via software, allowing them to easily adapt to test requirement changes and eliminate the need to add instruments to support system upgrades. The modular and open architecture enables equipment reuse, easy addition and expansion of test capabilities, and cost-effective long-term deployment.

Adaptive and Flexible Architecture Supports A Wide Ranges of Test Applications

HSSub architecture consists of three main components:

  • HSSub Apps Software controls HSSub instruments and provides reconfigurable test functionality and programming API for test development
  • HSSub TriFlex™ Software integrates and manages HSSub instruments and support modules while coordinating communication to the host test system
  • HSSub PXIe Reconfigurable Instruments programmable via HSSub App software to support a variety of test requirements and configurations

This architecture allows HSSub  to perform complex, high-speed and low latency test interactions with UUT as a distributed capability in a test system or as an autonomous subsystem.

The HSSub family of hardware and software provides a wide range of digital test capabilities, standard or unique, that can support many commercial and defense test applications such as AESA radars, communication network and switches, satellites, electronic warfare, missile guidance and targeting systems, streaming data, videos and displays.

HSSub Instrument and HSSub App

  • Reconfigurable Instruments – Reconfigurable FPGA-equipped serial bus and parallel digital instruments
  • Reconfigurable Flexible IO Instruments (FIOXI) – Reconfigurable FPGA-equipped instruments with flexible physical interfaces to support many different I/O types
  • Standard Bus Instruments – Widely used standard serial bus instruments
  • Support Modules – Additional hardware that provides extended test capability to the HSSub instruments, including real-time processing, optical conversion, data storage, and PXIe instrument use outside of the chassis.
  • HSSub App – Software that defines HSSub instrumentation test applications

Supported Test Applications

  • Dynamic Digital
  • Boundary Scan tests
  • Fast flash programming
  • Streaming data test
  • Optical switching and power control
  • Video capture and pattern generation
  • High-speed Serial up to 25 Gbps
  • High-speed Parallel LVDS up to 800 Mbps
  • Military bus emulation and test

Supported Bus Types

  • Fibre Channel
  • SMPTE 292
  • ARINC 818
  • PCI
  • PCIe
  • SFPDP
  • LVTTL
  • LVDS
  • I2C
  • RS485
  • RS422
  • RS232
  • IRIG-B
  • PRBS
  • ARINC 708
  • HOTLink
  • AS5643 FireWire
  • Ethernet 10M, 100M, 1G, 10G, 25G
  • USB
  • eSATA
  • MIL-STD-1553
  • ARINC 664
  • ARINC 429

Unique Test Applications

  • Teradyne offers test application development and training services. Visit Engineering Service and Total Test Solution to learn more
  • HSSub App development tools are available for customers looking to build their own HSSub Apps for unique bus test

Deployed Applications

  • Ruggedize Ancillary Kit for military ATS
  • Factory automation supporting Environmental Stress Screening (ESS)

Advantages

HSSub reconfigurable software-defined instruments provide endless test application possibilities and address rapidly evolving and emerging requirements

HSSub Apps leverage open architecture for TPS standardization and reuse, providing seamless transitions from test development to operation and maintenance

HSSub is modular, can be integrated into a system or subsystem and scaled to support all test phases of a product life cycle

HSSub’s proven reliability and Teradyne’s experience and commitment to long-term support assure cost-effective long-term deployment

System Options

Integrated Subsystem

  • 19-inch Rackmount with Virginia Panel G20 Interface
  • HSSub Remote Test Head
  • HSSub Optical I/O Interconnect

Ruggedized Subsystem

  • Mil-spec Ruggedized Packaging

Integrated Systems

ETS-200T

Eagle Test Systems ETS-200T

The ETS-200T discrete test platform is built on proven ETS technology and provides true index-parallel testing specifically for turret and rotary handlers. These test systems maximize throughput with pattern-based test techniques based on Eagle SmartPin™ technology coupled with the use of dynamic Cbits for enhanced user control. The ETS-200T provides a complete test solution from wafer sort to final test for MOSFETs, including integrated control and datalogging for UIL, dVSD, Qg and LCR meter.

eagle test systems ETS-200T

Advantages

Raptor Software

Prewritten subtests help users avoid programming limitations commonly found in many discrete test systems.

Integrated with rotary and turret handlers for a complete final test discrete solution.

Integrated help file provides a detailed description of the test along with additional block diagrams and tool tips for optimizing test routines.

Applications

The ETS-200T test systems provide solutions with average site counts equal to or in excess of 16, with coverage of both DC and AC testing parameters. The robust software package combines pre-programmed routines for standardized tests with flexible programming tools for easy creation of customized tests. Completely integrated AC testing, including UIL Inductive Switching, Cg, Rg and Qg makes the 200T the ideal solution for both wafer and packaged device testing of discrete devices.

System Options

Platform scalability is key in the semiconductor test market, and ETS-200T test system uses the same floating analog resources as the ETS-88 product family and ETS-364.

DVI: digital V/I supports 16-bit voltage measurements up to +/-20 V with 0.61 mV resolution in 50us.

HPU-100: single channel V/I with 10 current ranges operating up to +/-100 V

SPU Family (100, 112, 500): suite of V/I’s capable of addressing a wide range of test requirements ranging from 100V / 2A to 500V / 50mA with fully AWG and digitizing capabilities per channel

See More

Software

Raptor includes a graphical user interface that allows fast programming and characterization with no language-based programming required. This innovative user interface allows users to directly input test conditions for a particular test and place the test in a user defined test flow. The pre-programmed test routines provide simple and easy to use methods for test programming that help users avoid programming mistakes and overcome limitations commonly found in many discrete test systems. The Raptor FT software suite increases test development productivity.

As the leading provider of complete Test Cell Solutions and services, we at Teradyne leverage our expertise, experience, and technology leadership to help our customers achieve the highest yield and the highest throughput in production with the fastest time to market. We partner with you in your journey from design to production to provide standard and customized test cell products and services.

6020-Series

6020-Series Digital Test Instrumentation

PXIe digital instrument supporting parallel digital testing for LVDS technologies.

Defense and aerospace boxes and board designs frequently use low voltage TTL (LVTTL) and/or low voltage differential signaling (LVDS) technologies and often require boundary scan and parallel I/O flash programming test capability. 6020-Series instruments provide flexible, parallel digital functional test for units under test (UUTs) employing logic voltages between 1.8V to 3.3V (5V TTL tolerant).

Teradyne’s eDigital IVI driver controls all parallel digital functional test parameters, including per-pin timing, data formats, pattern data, and timing alignment on 64 channels (32 static + 32 dynamic or 32 differential)—each with an 8M pattern depth and results memory.

6020-Series instruments also capitalize on the boundary scan, parallel I/O, and flash programming capabilities, which are often included on these newer UUTs. Packaged in a compact PXIe form factor, 6020-Series instruments may be used as a standalone instrument or configured as part of an integrated HSSub system.

edigital 6020a digital test

Advantages

Superior LVTTL and LVDS digital test performance.
Its 1.8V to 3.3V (5V TTL tolerant) digital channels feature an 8M pattern depth and results memory at up to 25 MHz data rates across 32 differential or single-ended channels.

Device programming via boundary scan and third-party boundary scan support.
Supports JTAG, Asset, Corelis, and Acculogic boundary scan tools.

eDigital software driver.
Provides full control of per-pin timing, data format, and deskew across 64 static channels, or 32 dynamic and 32 static channels, or across 32 differential channels.

PXIe form factor.
Compact form factor maximizes performance density while reducing test system footprint.

Reliability and survivability.
High-density packaging and strict quality control including shock and vibration testing ensure low mean time between failure (MTBF) in the most rugged shipboard and mobile environments.

Worldwide support.
Available support services include 24-hour repair-and-return of defective parts, hotline telephone support, comprehensive training and documentation, and in-field calibration verification.

Applications

The 6020-Series instrument family features a host of critical test capabilities that cover a wide range of applications.

6020-Series applications include:

  • Parallel digital test
  • Single-ended and differential digital test
  • Conventional, parallel I/O and flash programming via boundary scan I2C +SPI and PCI via HSSub App

Configurations

6020-Series is available as a standalone instrument or as a member of the HSSub instrumentation family:

Configuration choices include:

  • eDigital-6020A
  • HSSub-6020
  • HSSub-6020 with funnel

System Options

Additional Capabilities and Accessories

  • Optional interface adapters and cables
  • Optional extended warranty/advanced replacement service

Di-Series

Di-Series Digital Test Instrumentation

Integrated, standards based VXI instruments for digital test

Newer, higher performance defense and aerospace systems require increasingly rigorous digital testing. The VXI-based Di-Series multi-channel test instruments support these requirements with a powerful combination of performance, flexibility, usability, and reliability.

The Di-Series tests all levels of integration from board level (SRA/SRU) to box level (WRA/LRU) units under test (UUTs), while maintaining full compatibility with previous generations of Teradyne instrumentation and systems. Excellent usability and reliability reduce programming and support effort, as well as straightforward upgrades of existing test program sets (TPS).

Di-Series instruments are used in the U.S. Department of Defense (DoD) Standard automatic test system (ATS), U.S. Army IFTE, U.S. Navy eCASS, CASS, and RTCASS testers, U.S. Air Force VDATS, and Spectrum 9100 avionics test systems.

di series digital test

Advantages

Superior performance.
Di-Series’ 50MHz speed, low voltage differential signaling (LVDS), and Quad-Detect™, which bands lower and upper limits of logic states, improve test quality, and decrease No Fault Found escapes.

LRU/WRA-Centric flexibility for bus-oriented digital tests.
Built-in capabilities, such as the Di-Series Handshake Engine, simplify asynchronous data transfer, improving test quality while reducing TPS programming time, complexity, and cost.

Unequaled usability.
Di-Series eliminates the need for shared resources with its independently programmed channels together with the iStudio™ graphic programming environment to speed TPS development and reduce cost.

Full compatibility.
Upgrade previous generations of Teradyne systems and instruments with the assurance that existing test programs are translated with proven TPS Converter Studio™ software.

Reliability and survivability.
High-density packaging and strict quality control including shock and vibration testing ensure low mean time between failure (MTBF) in the most rugged shipboard and mobile environments.

Worldwide support.
Available support services include 24-hour repair-and-return of defective parts, hotline telephone support, comprehensive training and documentation, and in-field calibration verification.

Applications

The Di-Series instruments feature a host of critical test capabilities that cover a wide range of applications.

Di-Series applications include:

  • Parallel digital test
  • Single-ended and differential digital test
  • Memory test
  • LRU/WRA test of new and legacy equipment
  • M9-Series and L-Series replacement

Configurations

Match Di-Series configurations to your current and future test needs:

Configuration choices include:

  • Operating speed: 25 MHz or 50MHz
  • Voltage range: ±15V or ±30V
  • Channel count: 32, 48 or 64

System Options

Additional Capabilities and Accessories

  • Optional interface adapters and cables
  • Optional extended warranty/advanced replacement service
Defense & Aerospace Home Page

Bi-Series

Multiple Module Serial Bus Test Instrument

COTS serial bus test instrument provides real-time emulation and test.

The wide variety of serial buses used in defense and aerospace applications typically requires multiple single-purpose instruments. Too often, they are difficult to reconfigure in order to test a different application.

The Bi4-Series provides all the capabilities needed for complete communications bus access test for up to four serial buses used in board level (SRA/SRU) and box level (WRA/LRU) equipment—all in a single VXI module.

The instrument includes test applications, industry-compliant software drivers and hardware enabling straightforward integration into automatic test systems.

With the configuration flexibility needed to effectively test every bus format used in defense and aerospace applications, the Bi4-Series instrument plays a key role in reducing implementation time and test system cost.

bi series bus test

Advantages

Synthetic Instrument Flexibility.
Test multiple standard and custom bus protocols using a single instrument.

Superior operational test.
Complete emulation as well as bus functional test capability increases UUT fault capture rate.

Emulates up to 4 buses simultaneously in a single VXI slot.
Lower acquisition cost and smaller footprint results in lower system integration cost, as well as lower TPS implementation and maintenance costs.

Straightforward upgrade capability
With its ability to address changing test requirements, the Bi-Series avoids test system obsolescence, resulting in reduced cost of long-term sustainment.

VXI plug&play™ software drivers supports C programming interface.
Reduces TPS development and maintenance costs with the fully supported C- programming interface that makes it easy to create new test models or modify existing ones.

Production-ready test equipment together with long-term Teradyne support.
Eliminating the problem of bus test obsolescence reduces test system logistics and maintenance costs—all supported by Teradyne’s decades of defense and aerospace test equipment expertise.

Applications

The Bi4-Series is the test solution for a wide variety of buses used in defense and aerospace applications.

Provides standard and serial bus protocol emulation and test for buses including:

  • MIL-STD-1553 A/B
  • ARINC 429
  • ARINC 573
  • RS-232
  • RS-422
  • RS-423
  • RS-485

Configurations

Multiple bus test capability

The Bi4-Series instruments are available in 2– and 4-bus modules.

System Options

Additional Capabilities and Accessories

  • MIC bus and CAN bus capability
  • Interface adapters and cables
  • Extended warranty/advanced replacement service

Spectrum HS

Spectrum HS

A Functional Test System Optimized for Real-Time Digital Bus Test

Defense and aerospace manufacturers and field repair depots face ever more rigorous demands for real-time test of boards, assemblies, and systems—especially new products in the development pipeline—that conventional testers can’t handle.

Spectrum HS is Teradyne’s fully integrated functional test system. Optimized for real-time test of low latency buses, it’s a high-performance system delivering excellent test coverage of current and future products.

Designed around PXI and LXI instrumentation, The HS system has the performance, flexibility, and completeness needed to meet formidable analog, digital, mixed-signal, and bus test specs.

Teradyne’s powerful hardware is accompanied by robust yet straightforward software tools that speed comprehensive test program set (TPS) development. More than five decades of Teradyne’s functional test experience are built into the Spectrum HS—the long-term answer to increasingly challenging high-speed test requirements.

Spectrum HS

Advantages

Faster TPS implementation.
Spectrum’s proven PC-based software development suite reduces TPS implementation time and cost while increasing test coverage. Proven PC-based software development tools reduce test implementation time and effort with full QA by Teradyne of ongoing software releases..

A flexible, integrated test system.
Spectrum HS incorporates industry-leading test functionality, switching, software, self-test and calibration capabilities in a single integrated system that includes power distribution and thermal management.

Open architecture eliminates the threat of obsolescence.
Spectrum HS open architecture incorporates industry standards—PXI, LXI,
VXI, GPIB, IVI, Windows, ATML, safety, EMI—together with expandable size and power, providing straightforward modular expansion as test needs evolve.

High-performance bus test.
Spectrum HS is capable of real-time test of complex buses on boards, assemblies and systems—and is built for the increasingly complex, higher-speed digital buses on the horizon.

Benefit from Teradyne’s application experience and global support
Every Spectrum HS comes with Teradyne’s experienced applications expertise backed by a worldwide support and maintenance infrastructure that ensures rapid setup and implementation, as well as available next-day spare parts service.

Teradyne is here for the long run.
The international trailblazer in semiconductor, production, and depot test for more than 5 decades, Teradyne continues to be the leader in integrated functional test systems for defense/aerospace applications.

Applications

Spectrum HS system applications include:

  • High-performance functional test for analog, digital and mixed boards, assemblies, and systems that incorporate high-speed, low latency busses used in products such as avionics, missiles, and vehicles.
  • Real-time bus testing for today’s and tomorrow’s boards, assemblies, and systems.
  • Performs in virtually every test environment including production test, depot repair of new and legacy products, including legacy rehosting.

Configurations

The Spectrum HS system is available in a virtually unlimited array of configurations—from compact to large:

  • Single bay through six bays
  • Single-tier, double-tier and triple-tier interfaces (ICA)
  • 6 KVA to 60 KVA input power

System Options

Spectrum HS features a broad range of options.

Spectrum HS is designed to work with all standard third-party instruments, including:

  • System level self-test
  • Configuration of ICA cables

Software: Available support for third party software in addition to Spectrum HS standard software.

Defense & Aerospace Home Page

Spectrum BT

Spectrum BT

Focused Functional Test for Engineering Lab, Production, and Depot

Designed to meet the needs of product engineering labs, production lines, test development centers, and repair depots, the Spectrum BT is a configurable and scalable functional test system. This focused system solves typical functional test coverage challenges throughout the defense/aerospace product life cycle—and it’s upgradable as test requirements evolve.

Fully TPS compatible with other Spectrum systems, its open PXI/LXI hardware and software environment eliminate the support, configurability, and documentation problems associated with inflexible purpose-built systems.

Unlike custom rack and stack testers, Spectrum BT is fully supported with Teradyne and third-party TPS development tools. It’s fully documented and supported worldwide.

Spectrum BT

Advantages

A wide range of receiver options.
Allows the re-use of engineering fixtures on a Spectrum HS production system.

Faster TPS implementation
Proven PC-based software development tools reduce test implementation time and effort with full QA by Teradyne of ongoing software releases.

Reduced TPS development cost.
Offload TPS development to the less expensive BT system that’s fully compatible with other members of the Spectrum test system family.

PXI/LXI-centric instrumentation flexibility for present and future test requirements.

  • An adaptable engineering development system for product design and debug.
  • A lower-cost TPS development platform that frees up larger, more expensive test systems for operational testing.
  • Spectrum BT supplements production process tests (In-circuit test, automated optical and X-Ray inspection, etc.) on the factory floor.
  • Enhances return-to-service productivity at the repair depot.

Benefit from Teradyne’s application experience and global support.
Every Spectrum BT comes with Teradyne’s experienced applications expertise backed by a worldwide support and maintenance infrastructure that ensures rapid setup and implementation, as well as available next-day spare parts service.

Teradyne is here for the long run.
The international trailblazer in semiconductor, production, and depot test for more than 5 decades, Teradyne continues to be the leader in integrated functional test systems for defense/aerospace applications.

Applications

Spectrum BT systems are at work where defense and aerospace products are designed, built, and used. Typical applications include:

  • Flexible and scalable product development platform for engineering labs.
  • Low cost TPS development platform.
  • Focused manufacturing test augments production process test.
  • Troubleshooting faulty products—either failures at manufacturing of field returns at depot test.

Configurations

The Spectrum BT base system includes:

  • Teradyne OEM PXIe chassis with controller
  • 2U Computer
  • 64-Channel 6020-Series digital instrument
  • Modular power supply
  • System self-test

System Options

Spectrum BT features a full range of useful options as well as numerous PXI/LXI instrument options to meet every test requirement.

  • Full G20 receiver for mass interconnects
  • Full G20X receiver for Spectrum HS compatibility
  • High Speed Subsystem
    • Serial, parallel, custom and standard bus support
    • Unique three-tier architecture incorporates the advantages of simple field-programmable gate array instruments
    • Real-time interaction with unit under test
    • VERTA Optical Test Capability
  • Switching
    • Crosspoint matrix
    • High Bandwidth switch modules
    • Switch management software
  • Third-Party Instruments
    • Spectrum BT is designed to work with all standard third-party instruments, including:
      • System level self-test
      • Configuration of ICA cables
    • Software: Available support for third party software in addition to Spectrum HS standard software.
    • Other Options:
      • Mobile Cart
      • Additional instrumentation space / Larger PXI chassis
      • Higher power PDUs
      • Work Surface
      • Articulating swing arm for display
Defense & Aerospace Home Page

Spectrum-9100

Spectrum-9100

High-Performance Integrated Functional Test Platform

The Spectrum-9100 is a fully integrated functional test system for factory, depot, and intermediate test applications. It’s the “go to” tester for users needing a mix of digital, analog, mixed-signal, and bus test capabilities across a wide range of products—from legacy boards to advanced systems.

An open, standards-based hardware and software architecture consists of fully developed, fully documented building blocks. These deliver the flexibility and scalability needed to speed test program set (TPS) development and simplify maintenance.

The Spectrum-9100 is a cost-effective test solution—the field-proven defense and aerospace standard for high-performance functional test. More than 300 systems are currently in use worldwide in factories and depots, as well as commercial avionics maintenance and repair facilities.

Spectrum-9100

Advantages

Comprehensive digital, analog, mixed-signal, and bus test capability.
Spectrum-9100 is the choice of defense and aerospace product manufacturers and depots requiring a powerful yet flexible functional test system to verify, and/or diagnose a wide variety of future, current, and legacy products.

The defense and aerospace ATE standard.
Spectrum-9100 is the industry standard whose wide-ranging test capability that eliminates problems associated with UUT compliance and validation tests.

A flexible, integrated test system.
Spectrum-9100 packs industry-leading test functionality, switching, software, self-test and calibration capabilities in a single integrated system that includes power distribution and thermal management.

Open architecture.
Spectrum-9100 open architecture incorporates industry standards—PXI, LXI, VXI, GPIB, IVI, Windows, ATML, safety, EMI—together with expandable size and power, providing straightforward modular expansion as test needs evolve.

Faster TPS implementation.
Spectrum’s proven PC-based software development suite reduces TPS implementation time and cost while increasing test coverage. Proven PC-based software development tools reduce test implementation time and effort with full QA by Teradyne of ongoing software releases.

Benefit from Teradyne’s application experience and global support.
Every Spectrum-9100 comes with Teradyne’s experienced applications expertise backed by a worldwide support and maintenance infrastructure that ensures rapid setup and implementation, as well as available next-day spare parts service.

Applications

Spectrum-9100 systems are at work where defense and aerospace products are tested. Applications include:

  • High-performance functional test for boards, assemblies, and systems used in defense/aerospace products such as avionics, missiles, and vehicles.
  • Applications requiring analog, digital, mixed-signal, and/or bus test including performance digital test, parallel test, real-time bus test.
  • Performs in virtually every test environment including production test, depot repair of new and legacy products, including legacy rehosting.

Configurations

The Spectrum-9100 system is available in a virtually unlimited array of configurations—from compact to large:

  • Single bay through six bays
  • Single-tier, double-tier and triple-tier interfaces (ICA)
  • 10 KVA to 60 KVA input power

System Options

Spectrum-9100 features a full range of options.

  • Analog Instruments
  • Bus Instruments
  • Digital Instruments
  • High Speed Subsystem
    • Serial, parallel, custom and standard bus support
    • Unique three-tier architecture incorporates the advantages of simple field-programmable gate array instruments
    • Real-time interaction with unit under test
    • Fully integrated with other Spectrum-9100 instrumentation
  • Switching
    • Crosspoint matrix optimized for Di-Series and Spectrum Analog Instruments.
    • High Bandwidth switch modules
    • Switch management software
  • Third-Party Instruments
    • Spectrum-9100 is designed to work with all standard third-party instruments, including:
      • System level self-test
      • Configuration of ICA cables
    • Software: Available support for third party software in addition to Spectrum-9100 standard software.
Defense & Aerospace Home Page

Saturn

Saturn

High-Density Disk Drive Test System

The Saturn HD is the industry leader in 3.5” Near-Line Hard Disk Drive (HDD) testing. It provides maximum throughput while minimizing factory floor space and power consumption. The system is designed to perform single insertion of SSW, BDSW and Burn-In as well as drive configuration. Using Saturn HD on the production floor will reduce drive build times, enable greater responsiveness to data center demands and lower test costs per HDD unit.

Offering the highest slot density per m2 in the industry, the Saturn HD can scale the number of test slots from approximately 4,000 to over 24,000 slots per system. Manufacturers using Saturn HD reduce the required factory floor space by 66% or more, versus a manual tester.

Teradyne’s automated HDD test solution provides optimized vibe control to test SSW and BDSW. This is a key feature to enable single insertion testing with burn-in and drive configuration. The system eliminates operator touch points, Work-in-Progress (WIP) and excess material on the test floor ensuring a very efficient test process. The end result is the highest throughput per m2 of floor space.

Power consumption is an important element of test costs. One of the biggest power consumers in back-end test is drive thermal control. The Saturn HD uses conductive heating strips for performing hot temperature tests that directly contact the drive rather than inefficiently having to warm air to raise disk drive temperatures. Within the tester, a unique closed loop cooling system is used to reduce the disk drive temperature to ambient for continued testing. This thermal control approach results in the lowest power consumption per drive slot in the industry.

In addition, the Saturn HD offers a beneficial capability for testing individual drive models in each slot due to the asynchronous operating architecture of the system. This provides manufacturers with product mix flexibility while maintaining peak throughput.

Advantages

Highest test slot density per m2 of the factory floor (3x over manual testers) – eliminates the need for multiple new factories

Highest through put per m2 of the factory floor

Efficient test process eliminates operator touch points and reduces drive lead time and WIP via ability to support single insertion of multiple test steps, including SSW and BDSW

Reduces power consumption per HDD tested

Per DUT thermal control and data collection

Asynchronous test slots can run individual drive models in each slot for total flexibility and optimized throughput

Applications

  • Back-End high volume manufacturing test for 3.5” HDDs in a single insertion
  • Tests helium-filled and air-filled drives used in Data Centers and Hyperscalers around the world
  • Supports both Windows and Linux operating systems
  • Executes customized test scripts via the system Applications Programming Interface (API)
  • Provides serial data System Management (SM) Bus or Universal Asynchronous Receiver Transmitter (UART) interfaces
  • Multi-temperature testing from ambient to +85°C
  • SSW and BDSW test capability in a single insertion
  • Extendable to interface with factory automation
  • Customizable data collection

Configurations

  • Can support both WIN and Linux
  • Run customer test scripts via system API
  • Serial data (SM Bus or UART) interface
  • Ambient to +85C test range
  • Vibe control for sensitive SSW and BDSW tests
  • Power per slot to per slot drive power control
  • Factory Automation friendly

System Options

Based on customer applications, need to contact sales for information

UltraFLEX

UltraFLEX

Test System Optimized for High-Performance Digital and SoC

Delivering superior economics and fast time to market with the industry’s highest rated software, the UltraFLEX test system has the power and precision you need for complex SoC devices. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count.

Advantages

Superior Flexibility, Throughput & Scalability

The UltraFLEX scales from low pin count, analog-dominant devices to massive parallel test of high-end processors with superior parallel.

Maximum Test Quality and Yield

The UltraFLEX’s performance allows integrated circuit producers to meet the conflicting goals of “zero” defect rates and maximum device.

Faster Time to Production

Teradyne’s IG-XL software speeds time to market and reduces cost of test by transforming test program development.

Applications

  • Mobile Application Processor
  • Digital Baseband Processors
  • High Data rate RF Transceivers
  • RF Connectivity Devices
  • mmWave
  • 5G
  • Mobile Power Management ICs (PMIC)
  • MicroProcessors
  • Network Processors
  • High Speed SERDES (SERializer/DESerializer) and backplane transceivers
  • Storage Controllers
  • High End Microcontrollers
  • Audio and Video Processors

Configurations

The two available UltraFLEX base systems allow customers to optimize capital cost, floor space and maximum resource count. All three versions will accept the same DIBs (Device Interface Boards) for application portability and use exactly the same instrument options for the most effective capital reuse and production flexibility. All heads feature a universal slot architecture, which allows any instrument to be installed in any slot.

The UltraFLEX test heads utilize SureMate® connections to the DIB which provides easy system reconfiguration and optimum instrument performance at the applications interface. Liquid cooling of high-density instrumentation also guarantees consistent hardware performance and increased reliability.

UltraFLEX-HD
12-slot system

UltraFLEX-SC
24-slot system

System Options

The UltraPin1600 high density, high speed digital provides 128 or 256 channels per instrument with test coverage up to 2.2Gbps. The UltraPin1600 implements Teradyne’s ground-breaking multicore, hardware-based Protocol Aware capability that allows individual pin groups to be saved to device data rate and timing and eliminates the need for digital patterns for programming standard data busses.

Proprietary hardware for same-cycle source synchronous capability and “walking strobe” timing measurements provides production test capability for high speed DDR and other critical applications when needed. The UltraPin1600 is also test program compatible with the earlier UltraPin800 and HSD1000 digital options.

The UltraWave12G/UltraWave24 high port count RF options provide up to 96 universal, vector RF ports with carrier frequencies and modulation bandwidths to cover the most advanced cellular and connectivity standards. The UltraWave options offer accuracy and phase noise performance equal to or better than the highest performance bench equipment available and integrate waveform sourcing and capturing onboard to eliminate the need for extra tester instruments. The UltraFLEX ESA software toolkit and UltraDSP1 option provide industry-standard modulation and demodulation tools running on up to 32 dedicated processing cores with automatic data download via a dedicated high speed data bus for simple correlation to industry standards and the highest possible throughput.

The UltraWaveMX44 and UltraWaveMX20 instruments enables faster time to market and higher product yields for semiconductor devices used in emerging mmWave applications. The MX44 and MX20 extend the UltraWave24 capability for full test coverage of IoT, WiFi, LTE, Ultra Wideband, and 5G standards while maintaining full DIB and docking compatibility.

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The UltraPAC80 high density AC source and capture instrument offers up to 8 source and capture channels, each with dedicated audio and video analog paths. Teradyne’s proprietary sample clock architecture provides the user with complete sample frequency flexibility without performance compromise and guaranteed phase alignment to every other instrument on every run of the test program to eliminate the need for job-specific calibration to achieve the phase balance required for the highest performance RF transceivers.

The UltraVI80 high pin count, high accuracy voltage and current option provides 80 independent pins of “3-in-1” capability.  Each UVI80 pin is a true voltage or current (VI) source and measure instrument complete with ultra high-accuracy differential voltmeters and time measurement units available to each pin for complete, massively paralleled testing of mobile power management devices. In addition, UVI80 channels can operate in a special, low-droop voltage source mode that offers unmatched power supply noise performance for sensitive analog and RF applications. Finally, each UVI80 channel has an embedded high performance AC waveform source and measure capability for highly paralleled test of D/A and A/D converters embedded in complex SOC or microcontroller devices.

The UltraVS256 high density Device Power Supply (DPS) provides 256 independent channels per instrument to provide the massively paralleled capability required by low power mobile communications devices. The UVS256 also offers a clamp-based current source capability for device parametric testing.  The UVS256 provides test engineers with the capability of programmable output bandwidth and full pattern setup and measure control that results in reduced DIB complexity and faster test times.

The HEXVS and VSM Ultra High Accuracy and Stability Processor Core Supplies improve performance and yield of complex processors by offering unmatched voltage accuracy and stability under load. This allows devices to be configured for maximum performance at lower voltages, increasing the value and yield of devices tested on UltraFLEX.

The DC30 and DC75 voltage/current supplies extend DC capability to 30 volts and 75 volts to address high voltage test requirements of of mobile power management and other devices. Like the UltraVI80, both options contain a precision differential voltmeter and time measurement capability.

The UltraSerial60G is the first ATE solution for testing 60Gbps high-speed devices. Designed for device characterization and production test on UltraFLEX, the instrument has 32 TX and 32 RX differential ports, enabling the industry’s highest parallelism. UltraSerial60G also has 32 independent built-in digitizers that ensure bench-top test quality with no additional DIB circuitry. 

The UltraPin4000 high speed, high precision digital option offers extremely high data rate capability with proprietary timing calibration options that allows unmatched timing accuracy to test the most challenging DDR interfaces on roadmap processors.

As the leading provider of complete Test Cell Solutions and services, we at Teradyne leverage our expertise, experience, and technology leadership to help our customers achieve the highest yield and the highest throughput in production with the fastest time to market. We partner with you in your journey from design to production to provide standard and customized test cell products and services.